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參數(shù)資料
| 型號(hào)： | AM41DL32X4GT85IS |
| 廠商： | Spansion Inc. |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; No. of Contacts:100; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:23; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:23-35 RoHS Compliant: No |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM |
| 文件頁(yè)數(shù)： | 11/65頁(yè) |
| 文件大小： | 1190K |
| 代理商： | AM41DL32X4GT85IS |
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10
Am41DL32x4G
November 12, 2001
P R E L I M I N A R Y
DEVICE BUS OPERATIONS
This section describes the requirements and use of
the device bus operations, which are initiated through
the internal command register. The command register
itself does not occupy any addressable memory loca-
tion. The register is a latch used to store the
commands, along with the address and data informa-
tion needed to execute the command. The contents of
the register serve as inputs to the internal state ma-
chine. The state machine outputs dictate the function
of the device. Tables 1 through 3 list the device bus
operations, the inputs and control levels they require,
and the resulting output. The following subsections de-
scribe each of these operations in further detail.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AM41DL32X4GT85IT | Circular Connector; No. of Contacts:100; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:23; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:23-35 RoHS Compliant: No |
| AM41DL6408G71IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408G71IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408G85IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408G85IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM41DL32X4GT85IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL32X8G | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Am41DL32x8G - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408G | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL6408G25IS | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 8 Mbit (1 M x 8-Bit/512 K x 16-Bit) Static RAM |
| AM41DL6408G25IT | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 8 Mbit (1 M x 8-Bit/512 K x 16-Bit) Static RAM |
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