參數(shù)資料
型號(hào)： AM41DL32X4GT70IS
廠商： Spansion Inc.
元件分類： DRAM
英文描述： Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述： 堆疊式多芯片封裝（MCP）閃存和SRAM
文件頁數(shù)： 43/65頁
文件大小： 1190K
代理商： AM41DL32X4GT70IS
42
Am41DL32x4G
November 12, 2001
P R E L I M I N A R Y
TEST CONDITIONS
Table 20.
Test Specifications
KEY TO SWITCHING WAVEFORMS
2.7 k
C
L
6.2 k
3.3 V
Device
Under
Test
Note:
Diodes are IN3064 or equivalent
Figure 11.
Test Setup
Test Condition
70, 85 ns
Unit
Output Load
1 TTL gate
Output Load Capacitance, C
L
(including jig capacitance)
30
pF
Input Rise and Fall Times
5
ns
Input Pulse Levels
0.0
–
3.0
V
Input timing measurement reference
levels
1.5
V
Output timing measurement
reference levels
1.5
V
KS000010-PAL
WAVEFORM
INPUTS
OUTPUTS
Steady
Changing from H to L
Changing from L to H
Don
’
t Care, Any Change Permitted
Changing, State Unknown
Does Not Apply
Center Line is High Impedance State (High Z)
3.0 V
0.0 V
1.5 V
1.5 V
Output
Measurement Level
Input
Figure 12.
Input Waveforms and Measurement Levels
相關(guān)PDF資料
PDF描述
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AM41DL32X4GT85IT Circular Connector; No. of Contacts:100; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:23; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:23-35 RoHS Compliant: No
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AM41DL32X4GT85IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
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