- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄375305 > AM41DL32X4GB70IT (Spansion Inc.) Circular Connector; No. of Contacts:41; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:21; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:21-41 RoHS Compliant: No PDF資料下載
參數(shù)資料
| 型號： | AM41DL32X4GB70IT |
| 廠商： | Spansion Inc. |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; No. of Contacts:41; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:21; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:21-41 RoHS Compliant: No |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM |
| 文件頁數(shù)： | 62/65頁 |
| 文件大?。?/td> | 1190K |
| 代理商： | AM41DL32X4GB70IT |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁當(dāng)前第62頁第63頁第64頁第65頁
November 12, 2001
Am41DL32x4G
61
P R E L I M I N A R Y
Flash Erase And Programming Performance
Notes:
1. Typical program and erase times assume the following conditions: 25
°
C, 3.0 V V
CC
, 1,000,000 cycles. Additionally,
programming typicals assume checkerboard pattern.
2. Under worst case conditions of 90
°
C, V
CC
= 2.7 V, 1,000,000 cycles.
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes
program faster than the maximum program times listed.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Tables
15 and 17 or further information on command definitions.
6. The device has a minimum erase and program cycle endurance of 1,000,000 cycles.
FLASH LATCHUP CHARACTERISTICS
Note:
Includes all pins except V
CC
. Test conditions: V
CC
= 3.0 V, one pin at a time.
PACKAGE PIN CAPACITANCE
Note:
7.Test conditions T
A
= 25
°
C, f = 1.0 MHz.
FLASH DATA RETENTION
Parameter
Typ (Note 1)
Max (Note 2)
Unit
Comments
Sector Erase Time
0.4
5
sec
Excludes 00h programming
prior to erasure (Note 4)
Chip Erase Time
28
sec
Byte Program Time
5
150
μs
Excludes system level
overhead (Note 5)
Word Program Time
7
210
μs
Accelerated Byte/Word Program Time
4
120
μs
Chip Program Time
(Note 3)
Byte Mode
21
63
sec
Word Mode
14
42
Description
Min
Max
Input voltage with respect to V
SS
on all pins except I/O pins
(including OE#, and RESET#)
–
1.0 V
12.5 V
Input voltage with respect to V
SS
on all I/O pins
–
1.0 V
V
CC
+ 1.0 V
V
CC
Current
–
100 mA
+100 mA
Parameter
Symbol
Description
Test Setup
Typ
Max
Unit
C
IN
Input Capacitance
V
IN
= 0
11
14
pF
C
OUT
Output Capacitance
V
OUT
= 0
12
16
pF
C
IN2
Control Pin Capacitance
V
IN
= 0
14
16
pF
C
IN3
WP#/ACC Pin Capacitance
V
IN
= 0
17
20
pF
Parameter Description
Test Conditions
Min
Unit
Minimum Pattern Data Retention Time
150
°
C
10
Years
125
°
C
20
Years
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AM41DL32X4GB85IS | Circular Connector; No. of Contacts:41; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:21; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:21-41 RoHS Compliant: No |
| AM41DL32X4GB85IT | Circular Connector; No. of Contacts:41; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:21; Circular Contact Gender:Socket; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No |
| AM41DL32X4GT70IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL32X4GT70IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL32X4GT85IS | Circular Connector; No. of Contacts:100; Series:MS27505; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:23; Circular Contact Gender:Pin; Circular Shell Style:Box Mount Receptacle; Insert Arrangement:23-35 RoHS Compliant: No |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM41DL32X4GB85IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL32X4GB85IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL32X4GT70IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL32X4GT70IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM41DL32X4GT85IS | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。