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參數(shù)資料
| 型號： | AH22S |
| 廠商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分類： | 放大器 |
| 英文描述： | 50 MHz - 1000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | PLASTIC, MS-012, SOIC-8 |
| 文件頁數(shù)： | 4/5頁 |
| 文件大?。?/td> | 487K |
| 代理商： | AH22S |
Specifications and information are subject to change without notice.
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 4 of 5 June 2005
The Communications Edge TM
AH22S
High Dynamic Range CATV Amplifier
Product Information
AH22S Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
q C
Thermal Resistance (1), Rth
28
q C/W
Junction Temperature (2), Tjc
130
q
Notes:
1. The thermal resistance is referenced from the hottest
part of the junction to ground tab underneath the
device.
2. This corresponds to the typical biasing condition of
+5V, 320 mA at an 85¤ C case
temperature.
A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160¤ C.
Product Marking
The component will be marked with an
“AH22S” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Passes from 500 to 1000 V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value
Passes greater than 1000 V
Test:
Charge Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 1 at +235¤ C convection reflow
Standard:
JEDEC Standard J-STD-020A
Functional Pin Layout
Pin
Function
1
RF input (Amp1 input)
2
Ground
3
Ground
4
RF input (Amp2 input)
5
RF output (Amp2 output)
6
Ground
7
Ground
8
RF output (Amp1 output)
The backside paddle is the Source and should be
grounded for thermal and electrical purposes.
Mounting Config. Notes
1.
Ground / thermal vias are critical for the proper performance
of this device.
Vias should use a .35mm (#80/.0135” )
diameter drill and have a final plated through diameter of
.25mm (.010” )
2.
Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3.
To ensure reliable operation, device ground paddle-to-ground
pad solder joint is critical.
4.
Add mounting screws near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts
the heatsink.
5.
For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
6.
RF trace width depends upon the PC board material and
construction.
7.
Use 1 oz. Copper minimum.
8.
If the PCB design rules allow, ground vias should be placed
under the land pattern for better RF and thermal performance.
Otherwise ground vias should be placed as close to the land
pattern as possible.
9.
All dimensions are in mm. Angles are in degrees.
MTTF vs. GND Tab Temperature
1
10
100
1000
60
70
80
90
100
110
Tab Temperature (°C)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AH22S-1G | 制造商:TriQuint Semiconductor 功能描述:AH22S-1G |
| AH22-SFL5W22E | 制造商:Fuji Electric 功能描述: |
| AH22-SFLY10 | 制造商:Fuji Electric 功能描述: |
| AH22S-G | 功能描述:射頻放大器 50-1000MHz +/-0.2dB Gain RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AH22S-PCB | 功能描述:射頻開發(fā)工具 Push-Pull Eval Brd 11dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
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