
DC and Power Characteristics
3-22
Revision 4
Dynamic Power Consumption of Various Internal Resources
Table 3-14 Different Components Contributing to the Dynamic Power Consumption in Fusion Devices
Parameter
Definition
Power Supply
Device-Specific
Dynamic Contributions
Units
Name
Setting AFS1500
AFS600
AFS250 AFS090
PAC1
Clock contribution of a Global
Rib
VCC
1.5 V
14.5
12.8
11
W/MHz
PAC2
Clock contribution of a Global
Spine
VCC
1.5 V
2.5
1.9
1.6
0.8
W/MHz
PAC3
Clock contribution of a VersaTile
row
VCC
1.5 V
0.81
W/MHz
PAC4
Clock contribution of a VersaTile
used as a sequential module
VCC
1.5 V
0.11
W/MHz
PAC5
First contribution of a VersaTile
used as a sequential module
VCC
1.5 V
0.07
W/MHz
PAC6
Second
contribution
of
a
VersaTile used as a sequential
module
VCC
1.5 V
0.29
W/MHz
PAC7
Contribution of a VersaTile used
as a combinatorial module
VCC
1.5 V
0.29
W/MHz
PAC8
Average contribution of a routing
net
VCC
1.5 V
0.70
W/MHz
PAC9
Contribution of an I/O input pin
(standard dependent)
VCCI
PAC10
Contribution of an I/O output pin
(standard dependent)
VCCI
PAC11
Average contribution of a RAM
block during a read operation
VCC
1.5 V
25
W/MHz
PAC12
Average contribution of a RAM
block during a write operation
VCC
1.5 V
30
W/MHz
PAC13
Dynamic Contribution for PLL
VCC
1.5 V
2.6
W/MHz
PAC15
Contribution of NVM block during
a read operation (F < 33MHz)
VCC
1.5 V
358
W/MHz
PAC16
1st contribution of NVM block
during a read operation (F > 33
MHz)
VCC
1.5 V
12.88
mW
PAC17
2nd contribution of NVM block
during a read operation (F > 33
MHz)
VCC
1.5 V
4.8
W/MHz
PAC18
Crystal Oscillator contribution
VCC33A 3.3 V
0.63
mW
PAC19
RC Oscillator contribution
VCC33A 3.3 V
3.3
mW
PAC20
Analog Block dynamic power
contribution of ADC
VCC
1.5 V
3
mW