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參數(shù)資料
| 型號(hào)： | ADUC7025BSTZ62-RL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 28/104頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MCU 12BIT 1MSPS UART 64-LQFP |
| 標(biāo)準(zhǔn)包裝： | 1,500 |
| 系列： | MicroConverter® ADuC7xxx |
| 核心處理器： | ARM7 |
| 芯體尺寸： | 16/32-位 |
| 速度： | 44MHz |
| 連通性： | EBI/EMI，I²C，SPI，UART/USART |
| 外圍設(shè)備： | PLA，PWM，PSM，溫度傳感器，WDT |
| 輸入/輸出數(shù)： | 30 |
| 程序存儲(chǔ)器容量： | 64KB（32K x 16） |
| 程序存儲(chǔ)器類型： | 閃存 |
| RAM 容量： | 2K x 32 |
| 電壓 - 電源 (Vcc/Vdd)： | 2.7 V ~ 3.6 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 12x12b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 125°C |
| 封裝/外殼： | 64-LQFP |
| 包裝： | 帶卷 (TR) |
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Data Sheet
ADuC7019/20/21/22/24/25/26/27/28/29
Rev. F | Page 3 of 104
REVISION HISTORY
5/13—Rev. E to Rev. F
Changes to Figure 1...........................................................................1
Added Figure 2 to Figure 10; Renumbered Sequentially.............4
Changes to Figure 19; Added Figure 20 .......................................21
Changes to EPAD Note in Figure 21 and Figure 22..................... 22
Changes to EPAD Note in Table 11.................................................... 23
Changes to EPAD Note in Figure 23 ............................................25
Changes to EPAD Note in Table 12 ..............................................26
Changes to Table 14 ........................................................................31
Changes to Table 15 ........................................................................33
Changes to Table 82 ........................................................................68
Added Table 83, Figure 73, Figure 74, Following Text, and
Table 84; Renumbered Sequentially..............................................69
Changes to Bit 2 Description, Table 98 ........................................71
Changes to Table 101 ......................................................................72
Changes to Timer2 (Wake-Up Timer) Section ...........................87
Changes to Figure 94 ......................................................................95
Updated Outline Dimensions........................................................97
Changes to Ordering Guide.........................................................101
7/12—Rev. D to Rev. E
Changed SCLOCK to SCLK When Refering to SPI Clock,
SPIMISO to MISO when Refering to SPI MISO, SPIMOSI to
MOSI when Refering to SPI MOSI, and SPICSL to CS when
Refering to SPI Chip Select...............................................Universal
Changes to Table 4, Table 5, and Figure 5....................................11
Changes to Endnote 1 in Table 6 and Figure 6............................12
Changes to Table 7 and Figure 7 ...................................................13
Changes to Table 8 and Figure 8 ...................................................14
Changes to Table 9 and Figure 9 ...................................................15
Changed EPAD Note in Figure 12 and Table 11.........................18
Changed EPAD Note in Figure 13 and Table 12.........................21
Changes to Bit 6 in Table 18...........................................................43
Changes to Example Source Code (External Crystal Selection)
Section and Example Source Code (External Clock Selection)
Section...............................................................................................55
Changes to Serial Peripheral Interface Section ...........................69
Changes to SPICON[10] and SPICON[9] Descriptions in
Table 123............................................................................................70
Changes to Timer Interval Down Equation and Added Timer
Interval Up Equation ......................................................................79
Added Hour:Minute:Second:1/128 Format Section...................80
Changes to Table 189 ......................................................................84
Removed CP-40-10 Package ..........................................................92
Changes to Ordering Guide...........................................................96
5/11—Rev. C to Rev. D
Changes to Table 4 ..........................................................................11
Changes to Table 105 ......................................................................67
Updated Outline Dimensions........................................................91
Changes to Ordering Guide...........................................................94
12/09—Rev. B to Rev. C
Added ADuC7029 Part ..................................................... Universal
Added Table Numbers and Renumbered Tables............... Universal
Changes to Figure Numbers ............................................. Universal
Changes to Table 1 ............................................................................6
Changes to Figure 3 .........................................................................9
Changes to Table 3 and Figure 4 ...................................................10
Changes to Table 10 ........................................................................16
Changes to Figure 55 ......................................................................53
Changes to Serial Peripheral Interface Section ...........................69
Changes to Table 137......................................................................73
Changes to Figure 71 and Figure 72 .............................................85
Changes to Figure 73 and Figure 74 .............................................86
Updated Outline Dimensions........................................................91
Changes to Ordering Guide...........................................................94
3/07—Rev. A to Rev. B
Added ADuC7028 Part ..................................................... Universal
Updated Format ................................................................. Universal
Changes to Figure 2 ..........................................................................5
Changes to Table 1 ............................................................................6
Changes to ADuC7026/ADuC7027 Section ...............................23
Changes to Figure 21 ......................................................................28
Changes to Figure 32 Caption .......................................................30
Changes to Table 14 ........................................................................35
Changes to ADC Circuit Overview Section................................38
Changes to Programming Section................................................44
Changes to Flash/EE Control Interface Section..........................45
Changes to Table 24 ........................................................................47
Changes to RSTCLR Register Section..........................................48
Changes to Figure 52 ......................................................................49
Changes to Figure 53 ......................................................................50
Changes to Comparator Section ...................................................50
Changes to Oscillator and PLL—Power Control Section..........51
Changes to Digital Peripherals Section........................................54
Changes to Interrupt System Section ...........................................75
Changes to Timers Section ............................................................76
Changes to External Memory Interfacing Section .....................80
Added IOVDD Supply Sensitivity Section.....................................84
Changes to Ordering Guide...........................................................90
1/06—Rev. 0 to Rev. A
Changes to Table 1 ............................................................................6
Added the Flash/EE Memory Reliability Section .......................43
Changes to Table 30 ........................................................................52
Changes to Serial Peripheral Interface .........................................66
Changes to Ordering Guide...........................................................90
10/05—Revision 0: Initial Version
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| ADUC7026BSTZ62 | 功能描述:IC MCU FLASH 62K W/ANLG 80LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:MicroConverter® ADuC7xxx 標(biāo)準(zhǔn)包裝:250 系列:56F8xxx 核心處理器:56800E 芯體尺寸:16-位 速度:60MHz 連通性:CAN，SCI，SPI 外圍設(shè)備:POR，PWM，溫度傳感器，WDT 輸入/輸出數(shù):21 程序存儲(chǔ)器容量:40KB（20K x 16） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:- RAM 容量:6K x 16 電壓 - 電源 (Vcc/Vdd):2.25 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 6x12b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:48-LQFP 包裝:托盤 配用:MC56F8323EVME-ND - BOARD EVALUATION MC56F8323 |
| ADUC7026BSTZ62I | 功能描述:IC MCU FLASH 62K ANLG I/0 80LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:MicroConverter® ADuC7xxx 標(biāo)準(zhǔn)包裝:250 系列:LPC11Uxx 核心處理器:ARM? Cortex?-M0 芯體尺寸:32-位 速度:50MHz 連通性:I²C，Microwire，SPI，SSI，SSP，UART/USART，USB 外圍設(shè)備:欠壓檢測/復(fù)位，POR，WDT 輸入/輸出數(shù):40 程序存儲(chǔ)器容量:96KB（96K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:4K x 8 RAM 容量:10K x 8 電壓 - 電源 (Vcc/Vdd):1.8 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 8x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-LQFP 包裝:托盤 其它名稱:568-9587 |
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