參數(shù)資料
型號: ADSP-BF535PKBZ-350
廠商: Analog Devices Inc
文件頁數(shù): 39/44頁
文件大?。?/td> 0K
描述: IC DSP CONTROLLER 16BIT 260-BGA
產(chǎn)品培訓(xùn)模塊: Blackfin® Processor Core Architecture Overview
Blackfin® Device Drivers
Blackfin® Optimizations for Performance and Power Consumption
Blackfin® System Services
標(biāo)準(zhǔn)包裝: 1
系列: Blackfin®
類型: 定點(diǎn)
接口: PCI,SPI,SSP,UART,USB
時(shí)鐘速率: 350MHz
非易失內(nèi)存: 外部
芯片上RAM: 308kB
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 1.60V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 260-BBGA
供應(yīng)商設(shè)備封裝: 260-PBGA(19x19)
包裝: 托盤
ADSP-BF535
–44–
REV. A
C
0
4
1
3
–0
–9
/0
4(
A)
OUTLINE DIMENSIONS
ORDERING GUIDE
Revision History
Figure 27. 260-Ball Metric Plastic Ball Grid Array (PBGA) (B-260)
Part Number
Temperature Range (Ambient)
Instruction Rate
Operating Voltage (V)
ADSP-BF535PKB-350
0C to +70C
350 MHz
1.0 V to 1.6 V internal, 3.3 V I/O
ADSP-BF535PKB-300
0C to +70C
300 MHz
1.0 V to 1.5 V internal, 3.3 V I/O
ADSP-BF535PBB-300
–40C to +85C
300 MHz
1.0 V to 1.5 V internal, 3.3 V I/O
ADSP-BF535PBB-200
–40C to +85C
200 MHz
1.0 V to 1.5 V internal, 3.3 V I/O
Location
Page
9/04—Data Sheet Changed from REV. 0 to REV. A
Changes to Clock Signals Section ........................................................................................................................ 13
Changes to Recommended Operating Conditions Footnote References ................................................................. 21
Changes to Electrical Characteristics ................................................................................................................... 21
Change to Table 11 ............................................................................................................................................ 24
Change to Figure 11 ............................................................................................................................................ 27
Change to Figure 12 ........................................................................................................................................... 28
Change to Output Drive Currents Section ............................................................................................................ 36
Replaced Figures 19, 20, and 21 .......................................................................................................................... 36
Changes to Power Dissipation Section ................................................................................................................. 36
Change to Table 26 ............................................................................................................................................ 36
DETAIL A
2.50
MAX
SEATING
PLANE
0.65
0.45
0.40
MIN
0.70
0.60
0.50
BALL DIAMETER
0.20
MAX, TYP
1.22
MAX
DETAIL A
TOP VIEW
BALL A1
INDICATOR
19.00 BSC SQ
17.05
16.95 SQ
16.85
15 13 11 9
7
5
3
1
17
16 14 12 10 8
6
4
2
18
BOTTOM VIEW
1.00 BSC
BALL PITCH
17.00
BSC
SQ
1.00
BSC
NOTES
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. THE ACTUAL POSITION OF THE BALL GRID
IS WITHIN 0.25 MM OF ITS IDEAL POSITION
RELATIVE TO THE PACKAGE EDGES.
3. THE ACTUAL POSITION OF EACH BALL IS
WITHIN 0.10 MM OF ITS IDEAL POSITION RELATIVE
TO THE BALL GRID.
4. CENTER DIMENSIONS ARE NOMINAL.
5. COMPLIANT TO JEDEC REGISTERED OUTLINE
MS-034, VARIATION AAG-1.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
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