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參數(shù)資料
| 型號： | ADP5261 |
| 元件分類： | 壓力傳感器 |
| 英文描述： | GAGE, STRAIN GUAGE PRESSURE SENSOR, 0-72.51Psi, 1.25%, 0.50-4.50V, RECTANGULAR, SURFACE MOUNT |
| 封裝： | SMD-6 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 248K |
| 代理商： | ADP5261 |
PS-A (ADP5)
4. SMD terminal (Pressure inlet hole: 5mm) ADP52*1
NC
GND NC
Vcc NC Vout
±0.3
.394±.012
0.5
.020
JAPAN
.098±.010
2.5±0.25
.098±.010
2.5±0.25
0.25
±0.1
.010
±.004
NC
GND
NC
T
Y
R
W
Q
E
Atmospheric
pressure
inlet hole
Pressure
inlet hole
2.2 dia.
.087 dia.
R0.2
R
.0
08
3.0
dia.
4-R0.7
4-R.028
0.5±0.1
.020±.004
0
–0.1
.118
dia.
0
–.004
7.2
.283
7.0
.276
1.8
.071
7.2
.283
7.0
.276
0.15±0.1
.006±.004
8.5
.335
5.0
.197
Recommended PC board pattern
(TOP VIEW 2:1)
Terminal connection diagram
Terminal No.
Name
1
Vcc (Power supply [+])
2
NC (No connection)
3
Vout (Output)
4
NC (No connection)
5
NC (No connection)
6
GND (Ground)
2.5
.098
2.5
.098
1.1
.043
9.5
.374
1.9
.075
Vcc (5V DC)
Vout
C (0.1
F)
GND
mm inch
General tolerance: ±0.3 ±.012
NOTES
1. Mounting
Use lands on the printed-circuit boards to
which the sensor can be securely xed.
2. Soldering
Due to its small size, the thermal capacity
of the pressure sensor DIP type is low.
Therefore, take steps to minimize the
effects of external heat.
Damage and changes to characteristics
may occur due to heat deformation.
Use a non-corrosive resin type of ux.
Since the pressure sensor DIP type is
exposed to the atmosphere, do not allow
ux to enter inside.
1) Manual soldering
Set the soldering tip from 260 to 300°C
(30W), and solder for no more than 5
seconds.
Please note that output may change if
the pressure is applied on the terminals
when the soldering.
Thoroughly clean the soldering iron.
2) DIP soldering (DIP terminal type)
Please keep the DIP solder bath
temperature no higher than 260°C. When
soldering, heat should be applied no
longer than ve seconds.
When mounting onto a PCB of low
thermal capacity, please avoid DIP
soldering as this may cause heat
deformity.
3) Reow soldering (SMD terminal type)
The recommended reow temperature
prole conditions are given below.
We recommend the screen solder
printing method as the method for cream
solder printing.
Please refer to the recommended PCB
specication diagram for the PCB foot
pattern.
Self alignment may not always work as
expected; therefore, please carefully
adjust the position of the terminals and
pattern.
The prole temperature is the value
measured on the PCB near the terminals.
When doing reow soldering on the back
of the PC board after performing sensor
reow, please x the sensor with adhesive
and so on.
4) Solder reworking
Finish reworking in one operation.
For reworking of the solder bridge, use a
soldering iron with a at tip. Please do not
add more ux when reworking.
Please use a soldering iron that is below
the temperature given in the
specications in order to maintain the
correct temperature at the tip of the
soldering iron.
5) Too much force on the terminals will
cause deformation and loss in
effectiveness of the solder. Therefore,
please avoid dropping and careless
handling of the product.
6) Please control warping of the PCB
within 0.05 mm of the sensor width.
7) When cut folding the PCB after
mounting the sensor, take measures to
prevent stress to the soldered parts.
8) The sensor terminals are designed to
be exposed, so contact of the terminals
with metal shards and the like will cause
output errors. Therefore, please be
careful and prevent things such as metal
shards and hands from contacting the
terminals.
9) To prevent degradation of the PCB
insulation after soldering, please be
careful not to get chemicals on the sensor
when coating.
10) Please consult us regarding the use of
lead-free solder.
3. Connections
1) Please perform connections correctly
in accordance with the terminal
connection diagram. In particular, be
careful not to reverse wire the power
supply as this will cause damage or
degrade to the product.
2) Do not connect terminals that are not
used. This can cause malfunction of the
sensor.
With in
60 sec.
Preheating
Time
Temperature
Peak temperature
150
°C
302
°F
230
°C
446
°F
(230
°C
446
°F max.
and 10 sec. max.)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ADP5251 | GAGE, STRAIN GUAGE PRESSURE SENSOR, 0-29Psi, 1.25%, 0.50-4.50V, RECTANGULAR, SURFACE MOUNT |
| ADP5270 | GAGE, STRAIN GUAGE PRESSURE SENSOR, 0-145.03Psi, 1.25%, 0.50-4.50V, RECTANGULAR, SURFACE MOUNT |
| ADP5200 | GAGE, STRAIN GUAGE PRESSURE SENSOR, 0-14.5Psi, 1.25%, 0.50-4.50V, RECTANGULAR, SURFACE MOUNT |
| ADP5260 | GAGE, STRAIN GUAGE PRESSURE SENSOR, 0-72.51Psi, 1.25%, 0.50-4.50V, RECTANGULAR, SURFACE MOUNT |
| ADP5210 | GAGE, STRAIN GUAGE PRESSURE SENSOR, 0--14.5Psi, 1.25%, 0.50-4.50V, RECTANGULAR, SURFACE MOUNT |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADP5270 | 功能描述:板上安裝壓力/力傳感器 1000 kPa 3 mm Pressure Sensor SMD RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準確性:+ / - 0.25 % 輸出類型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides |
| ADP5271 | 功能描述:板上安裝壓力/力傳感器 1000 kPa 5 mm Pressure Sensor SMD RoHS:否 制造商:Honeywell 工作壓力:0 bar to 4 bar 壓力類型:Gage 準確性:+ / - 0.25 % 輸出類型:Digital 安裝風(fēng)格:Through Hole 工作電源電壓:5 V 封裝 / 箱體:SIP 端口類型:Dual Radial Barbed, Same sides |
| ADP52PLCC-SM | 制造商:FCI 功能描述: |
| ADP5300ACPZ-1-R7 | 功能描述:Buck Switching Regulator IC Positive Programmable 0.8V 1 Output 50mA, 500mA 10-WFDFN Exposed Pad, CSP 制造商:analog devices inc. 系列:- 包裝:剪切帶（CT） 零件狀態(tài):有效 功能:降壓 輸出配置:正 拓撲:降壓 輸出類型:可編程 輸出數(shù):1 電壓 - 輸入（最小值）:2.15V 電壓 - 輸入（最大值）:6.5V 電壓 - 輸出（最小值/固定）:0.8V 電壓 - 輸出（最大值）:5V 電流 - 輸出:50mA，500mA 頻率 - 開關(guān):2MHz 同步整流器:是 工作溫度:-40°C ~ 125°C （TJ） 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤，CSP 供應(yīng)商器件封裝:10-LFCSP-WD（3x3） 標準包裝:1 |
| ADP5300ACPZ-2-R7 | 功能描述:Buck Switching Regulator IC Positive Programmable 0.8V 1 Output 50mA, 500mA 10-WFDFN Exposed Pad, CSP 制造商:analog devices inc. 系列:- 包裝:剪切帶（CT） 零件狀態(tài):有效 功能:降壓 輸出配置:正 拓撲:降壓 輸出類型:可編程 輸出數(shù):1 電壓 - 輸入（最小值）:2.15V 電壓 - 輸入（最大值）:6.5V 電壓 - 輸出（最小值/固定）:0.8V 電壓 - 輸出（最大值）:5V 電流 - 輸出:50mA，500mA 頻率 - 開關(guān):2MHz 同步整流器:是 工作溫度:-40°C ~ 125°C （TJ） 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤，CSP 供應(yīng)商器件封裝:10-LFCSP-WD（3x3） 標準包裝:1 |
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