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參數(shù)資料
| 型號(hào)： | ADG936 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | Wideband 4 GHz, 36 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, Dual SPDT |
| 中文描述： | 寬帶4千兆赫，36個(gè)1千兆赫的CMOS 1.65 V分貝至2.75 V的隔離，雙路SPDT |
| 文件頁數(shù)： | 14/16頁 |
| 文件大?。?/td> | 395K |
| 代理商： | ADG936 |
ADG936/ADG936-R
ORDERING GUIDE
Model
ADG936BRU
ADG936BRU-500RL7
ADG936BRU-REEL
ADG936BRU-REEL7
ADG936BCP
ADG936BCP-500RL7
ADG936BCP-REEL
ADG936BCP-REEL7
ADG936BRU-R
ADG936BRU-R-500RL7
ADG936BRU-R-REEL
ADG936BRU-R-REEL7
ADG936BCP-R
ADG936BCP-R-500RL7
ADG936BCP-R-REEL
ADG936BCP-R-REEL7
EVAL-ADG936EB
EVAL-ADG936-REB
Rev. 0 | Page 14 of 16
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Evaluation Board
Evaluation Board
Package Option
RU-20
RU-20
RU-20
RU-20
CP-20-1
CP-20-1
CP-20-1
CP-20-1
RU-20
RU-20
RU-20
RU-20
CP-20-1
CP-20-1
CP-20-1
CP-20-1
RU-20
RU-20
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ADG936BCP | Wideband 4 GHz, 36 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, Dual SPDT |
| ADG936BCP-500RL7 | Wideband 4 GHz, 36 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, Dual SPDT |
| ADG936BCP-R | Wideband 4 GHz, 36 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, Dual SPDT |
| ADG936BCP-REEL | Wideband 4 GHz, 36 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, Dual SPDT |
| ADG936BCP-REEL7 | Wideband 4 GHz, 36 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, Dual SPDT |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADG936BCP | 制造商:Analog Devices 功能描述:RF Switch SPDT 0MHz to 2GHz 31dB 20-Pin LFCSP EP 制造商:Rochester Electronics LLC 功能描述:W'BAND ABSORBTIVE/REFL'VE DUAL SPDT IC - Bulk |
| ADG936BCP-500RL7 | 制造商:Analog Devices 功能描述:RF Switch SPDT 0MHz to 2GHz 31dB 20-Pin LFCSP EP T/R |
| ADG936BCP-R | 制造商:Analog Devices 功能描述:RF Switch SPDT 0MHz to 2GHz 31dB 20-Pin LFCSP EP |
| ADG936BCP-R-500RL7 | 制造商:Analog Devices 功能描述:RF Switch SPDT 0MHz to 2GHz 31dB 20-Pin LFCSP EP T/R |
| ADG936BCP-REEL | 制造商:Analog Devices 功能描述:RF Switch SPDT 0MHz to 2GHz 31dB 20-Pin LFCSP EP T/R |
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