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ADG466/ADG467
–3–
REV. A
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= +25
°
C unless otherwise noted)
V
DD
to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V
V
S
, V
D
, Analog Input Overvoltage with Power ON
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . .V
SS
– 20 V to V
DD
+ 20 V
V
S
, V
D
, Analog Input Overvoltage with Power OFF
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–35 V to +35 V
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . . . –65
°
C to +125
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°
C
Plastic DIP Package
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 125
°
C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260
°
C
SOIC Package
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 160
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
μ
SOIC Package
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 160
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
SSOP Package
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 130
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability. Only one absolute maxi-
mum rating may be applied at any one time.
2
Overvoltages at S or D will be clamped by the channel protector, see Circuit
Information section of the data sheet.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG466/ADG467 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATIONS
8-Lead
DIP, SOIC
and
m
SOIC
18-Lead
SOIC
1
2
3
4
8
7
6
5
TOP VIEW
(Not to Scale)
ADG466
V
D1
V
S3
V
S2
V
S1
V
DD
V
D2
V
D3
V
SS
14
13
12
11
17
16
15
18
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
ADG467
V
D1
V
S3
V
S2
V
S1
V
DD
V
D2
V
D3
V
D4
V
S6
V
S5
V
S4
V
D5
V
D6
V
D7
V
D8
V
SS
V
S8
V
S7
20-Lead
SSOP
V
D1
V
S3
V
S2
V
S1
V
DD
V
D2
V
D3
V
D4
V
S6
V
S5
V
S4
V
D5
V
D6
V
D7
V
D8
V
SS
V
S8
V
S7
14
13
12
11
17
16
15
20
19
18
10
9
8
1
2
3
4
7
6
5
TOP VIEW
(Not to Scale)
ADG467
NC = NO CONNECT
NC
NC
ORDERING GUIDE
Model
Temperature Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Package Description
Package Options
ADG466BN
ADG466BR
ADG466BRM
ADG467BR
ADG467BRS
8-Lead Plastic DIP
8-Lead Small Outline Package
8-Lead Micro Small Outline Package
18-Lead Small Outline Package
20-Lead Shrink Small Outline Package
N-8
SO-8
RM-8
R-18
RS-20
WARNING!
ESD SENSITIVE DEVICE