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ADG1406/ADG1407
Rev. A | Page 8 of
20
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 7.
Parameter
Rating
VDD to VSS
35 V
VDD to GND
0.3 V to +25 V
VSS to GND
+0.3 V to 25 V
VSS 0.3 V to VDD + 0.3 V
or 30 mA, whichever
occurs first
Continuous Current, Sx or Dx Pins
specifications + 15%
Peak Current, Sx or Dx Pins (Pulsed
at 1 ms, 10% Duty Cycle
Maximum)
28-Lead TSSOP
300 mA
32-Lead LFCSP_VQ
550 mA
Operating Temperature Range
Industrial (B Version)
–40°C to +125°C
Storage Temperature Range
–65°C to +150°C
Junction Temperature
150°C
Reflow Soldering, Pb-Free
Peak Temperature
260 (+0/5)°C
Time at Peak Temperature
10 sec to 40 sec
1 Overvoltages at the Ax, EN, Sx, or Dx pins are clamped by internal diodes.
Limit current to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance
Package Type
θJA
θJC
Unit
28-Lead TSSOP
97.9
14
°C/W
32-Lead LFCSP_VQ
27.27
°C/W
ESD CAUTION