參數(shù)資料
型號(hào): ADA4051-2ACPZ-R7
廠商: Analog Devices Inc
文件頁(yè)數(shù): 16/20頁(yè)
文件大?。?/td> 0K
描述: IC OPAMP RRIO ZERO DRIFT 8LFCSP
標(biāo)準(zhǔn)包裝: 1,500
放大器類型: 零漂移
電路數(shù): 2
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 0.06 V/µs
增益帶寬積: 125kHz
電流 - 輸入偏壓: 20pA
電壓 - 輸入偏移: 2µV
電流 - 電源: 13µA
電流 - 輸出 / 通道: 15mA
電壓 - 電源,單路/雙路(±): 1.8 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-VFDFN 裸露焊盤,CSP
供應(yīng)商設(shè)備封裝: 8-LFCSP-VD(3x3)
包裝: 帶卷 (TR)
ADA4051-1/ADA4051-2
Rev. B | Page 5 of 20
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 4.
Parameter
Rating
Supply Voltage
6 V
Input Voltage
±VSY ± 0.3 V
Input Current1
±10 mA
Differential Input Voltage2
±VSY
Output Short-Circuit Duration to GND
Indefinite
Storage Temperature Range
65°C to +150°C
Operating Temperature Range
40°C to +125°C
Junction Temperature Range
65°C to +150°C
Lead Temperature (Soldering, 60 sec)
300°C
θJA is specified for the worst-case conditions, that is, a device
soldered on a circuit board for surface-mount packages with its
exposed paddle soldered to a pad, if applicable. Table 5 shows
simulated thermal values for a 4-layer (2S2P) JEDEC standard
thermal test board, unless otherwise specified.
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
5-Lead SOT-23 (RJ-5)
190
92
°C/W
5-Lead SC-70 (KS-5)
534
173
°C/W
8-Lead MSOP (RM-8)
142
45
°C/W
8-Lead LFCSP (CP-8-2)
77
14
°C/W
1 The input pins have clamp diodes to the power supply pins. Limit the input
current to 10 mA or less whenever input signals exceed the power supply
rail by 0.3 V.
POWER SEQUENCING
2 Inputs are protected against high differential voltages by internal series
1.33 kΩ resistors and back-to-back diode-connected N-MOSFETs (with a
typical VT of 0.7 V for VCM of 0 V).
The op amp supplies must be established simultaneously with
or before any input signals are applied. If this is not possible, the
input current must be limited to 10 mA.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
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