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參數(shù)資料
| 型號(hào)： | ADA10000RS3P1 |
| 廠商： | ANADIGICS INC |
| 元件分類： | 放大器 |
| 英文描述： | 50 MHz - 1000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | ROHS COMPLIANT, S3, SOIC-16 |
| 文件頁數(shù)： | 2/12頁 |
| 文件大?。?/td> | 264K |
| 代理商： | ADA10000RS3P1 |
10
Data Sheet - Rev 2.5
05/2005
ADA10000
PACKAGE OUTLINE
H
E
e
B 1
A
B
A2
L
a
C
LE
0.003 [0.076mm]
A1
GAUGE PLANE
SEATING PLANE
D
0.015 [0.38]X45
a
L
e
E
A
D
B
L
S
O
Y
B
M
MILLIMETERS
INCHES
NOTE
MAX.
MIN.
MAX.
MIN.
H
LE
C
2
3
4
1
B
0.020
0.50
0.33
0.013
0.10
1.47
0.25
1.73
0.068
0.010
0.058
0.004
0.055
0.065
1.65
1.40
0.25
0.20
0.010
0.008
8
0
8
0
6.20
5.74
0.244
0.226
0.380
0.150
0.400
0.160
4.06
10.16
3.81
9.66
0.050 BSC
1.27 BSC
0.016
0.040
0.41
1.02
0.030
0.76
0.062
1.58
1.78
0.070
4. LEAD THICKNESS AFTER PLATING TO BE 0.013 [0.33mm]
MAXIMUM.
PER SIDE.
1. CONTROLLING DIMENSION: INCHES
2. DIMENSION "D" DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS
AND GATE BURRS SHALL NOT EXCEED 0.006 [0.15mm]
3. DIMENSION "E" DOES NOT INCLUDE INTER-LEAD FLASH OR
PROTRUSIONS. INTER-LEAD FLASH AND PROTRUSIONS
SHALL NOT EXCEED 0.010 [0.25mm] PER SIDE.
NOTES:
A2
A1
Figure 20: S3 Package Outline - Modified 16 Pin SOIC
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