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      參數(shù)資料
      型號(hào): AD9639BCPZ-210
      廠商: Analog Devices Inc
      文件頁(yè)數(shù): 35/36頁(yè)
      文件大?。?/td> 0K
      描述: IC ADC 12B 170MSPS QUAD 72LFCSP
      標(biāo)準(zhǔn)包裝: 1
      位數(shù): 12
      采樣率(每秒): 210M
      數(shù)據(jù)接口: 串行,SPI?
      轉(zhuǎn)換器數(shù)目: 4
      功率耗散(最大): 1.22W
      電壓電源: 模擬和數(shù)字
      工作溫度: -40°C ~ 85°C
      安裝類型: 表面貼裝
      封裝/外殼: 72-VFQFN 裸露焊盤,CSP
      供應(yīng)商設(shè)備封裝: 72-LFCSP
      包裝: 托盤
      輸入數(shù)目和類型: 8 個(gè)單端,單極;4 個(gè)差分,單極
      AD9639
      Data Sheet
      Rev. B | Page 8 of 36
      ABSOLUTE MAXIMUM RATINGS
      Table 5.
      Parameter
      Rating
      AVDD to AGND
      0.3 V to +2.0 V
      DRVDD to DRGND
      0.3 V to +2.0 V
      AGND to DRGND
      0.3 V to +0.3 V
      AVDD to DRVDD
      2.0 V to +2.0 V
      DOUT + x/DOUT x to DRGND
      0.3 V to DRVDD + 0.3 V
      SDO, SDI/SDIO, CLK±, VIN ± x, VCM x,
      TEMPOUT, RBIAS to AGND
      0.3 V to AVDD + 0.3 V
      SCLK, CSB, PGMx, RESET, PDWN
      to AGND
      0.3 V to AVDD + 0.3 V
      Storage Temperature Range
      65°C to +125°C
      Operating Temperature Range
      40°C to +85°C
      Lead Temperature (Soldering, 10 sec)
      300°C
      Junction Temperature
      150°C
      Stresses above those listed under Absolute Maximum Ratings
      may cause permanent damage to the device. This is a stress
      rating only; functional operation of the device at these or any
      other conditions above those indicated in the operational
      section of this specification is not implied. Exposure to absolute
      maximum rating conditions for extended periods may affect
      device reliability.
      THERMAL RESISTANCE
      The exposed paddle must be soldered to the ground plane for the
      LFCSP package. Soldering the exposed paddle to the printed
      circuit board (PCB) increases the reliability of the solder joints,
      maximizing the thermal capability of the package.
      Table 6. Thermal Resistance
      Package Type
      θJA
      θJB
      θJC
      Unit
      72-Lead LFCSP (CP-72-3)
      16.2
      7.9
      0.6
      °C/W
      Typical θJA, θJB, and θJC values are specified for a 4-layer board in
      still air. Airflow increases heat dissipation, effectively reducing
      θJA. In addition, metal in direct contact with the package leads
      from metal traces, through holes, ground, and power planes
      reduces θJA.
      ESD CAUTION
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