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AD9300
–4–
REV. A
SUGGE ST E D LAY OUT OF AD9300
PC BOARD
AD9300 BURN-IN DIAGRAM
AD9300 Timing Diagram
ME T ALIZAT ION PHOT OGRAPH
ME CHANICAL INFORMAT ION
Die Dimensions . . . . . . . . . . . . . . . . .84
×
104
×
18 (max) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 4
×
4 (min) mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aluminum
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –V
S
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Oxynitride
Die Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold Eutectic
Bond Wire . . . . . . . . 1.25 mil, Aluminum; Ultrasonic Bonding
or 1 mil, Gold; Gold Ball Bonding
LOGIC T RUT H T ABLE
E NABLE
A
1
A
0
OUT PUT
0
1
1
1
1
X
0
0
1
1
X
0
1
0
1
High Z
IN
1
IN
2
IN
3
IN
4
FUNCT IONAL DE SCRIPT ION
IN
1
–IN
4
Four analog input channels.
GROUND
Analog input shielding grounds, not internally con-
nected. Connect each to external low-impedance
ground as close to device as possible.
A
0
One of two T T L decode control lines required for
channel selection. See Logic T ruth T able.
A
1
One of two T T L decode control lines required for
channel selection. See Logic T ruth T able.
ENABLE
T T L-compatible chip enable. In enabled mode
(logic HIGH), output signal tracks selected input
channel; in disabled mode (logic LOW), output is
high impedance and no signal appears at output.
–V
S
Negative supply voltage; normally –10 V dc to
–15 V dc.
+V
S
Positive supply voltage; normally +10 V dc to
+15 V dc.
OUT PUT
Analog output. T racks selected input channel when
enabled.
BYPASS
Bypass terminal for internal bias line; must be
decoupled externally to ground through 0.1
μ
F
capacitor.
GROUND
Analog signal and power supply ground return.
RET URN