參數(shù)資料
型號： AD9211-300EBZ
廠商： Analog Devices, Inc.
英文描述： 10-Bit, 200 MSPS/250 MSPS/300 MSPS, 1.8 V Analog-to-Digital Converter
中文描述： 10位，200 MSPS/250 MSPS/300 MSPS的，1.8 V模擬到數(shù)字轉(zhuǎn)換器
文件頁數(shù)： 8/28頁
文件大?。?/td> 1180K
代理商： AD9211-300EBZ
AD9211
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
ELECTRICAL
AVDD to AGND
DRVDD to DRGND
AGND to DRGND
AVDD to DRVDD
D0+/D0 through D9+/D9
to DRGND
DCO to DRGND
OR to DGND
CLK+ to AGND
CLK to AGND
VIN+ to AGND
VIN to AGND
SDIO/DCS to DGND
PWDN to AGND
CSB to AGND
SCLK/DFS to AGND
ENVIRONMENTAL
Storage Temperature Range
Operating Temperature Range
Lead Temperature
(Soldering 10 sec)
Junction Temperature
Rev. 0 | Page 8 of 28
Rating
0.3 V to +2.0 V
0.3 V to +2.0 V
0.3 V to +0.3 V
2.0 V to +2.0 V
0.3 V to DRVDD + 0.3 V
0.3 V to DRVDD + 0.3 V
0.3 V to DRVDD + 0.3 V
0.3 V to +3.9 V
0.3 V to +3.9 V
0.3 V to AVDD + 0.2 V
0.3 V to AVDD + 0.2 V
0.3 V to DRVDD + 0.3 V
0.3 V to +3.9 V
0.3 V to +3.9 V
0.3 V to +3.9 V
65°C to +125°C
40°C to +85°C
300°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane
for the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 6.
Package Type
56-Lead LFCSP (CP-56-2)
θ
JA
30.4
θ
JC
2.9
Unit
°C/W
Typical θ
JA
and θ
JC
are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, metal in direct contact with the package leads from
metal traces, and through holes, ground, and power planes
reduces the θ
JA
.
ESD CAUTION
相關(guān)PDF資料
PDF描述
AD9211BCPZ-300 10-Bit, 200 MSPS/250 MSPS/300 MSPS, 1.8 V Analog-to-Digital Converter
AD9211 10-Bit, 170/200/250 MSPS 1.8 V A/D Converter
AD9211-170EB 10-Bit, 170/200/250 MSPS 1.8 V A/D Converter
AD9211-200EB 10-Bit, 170/200/250 MSPS 1.8 V A/D Converter
AD9211-250EB 10-Bit, 170/200/250 MSPS 1.8 V A/D Converter
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AD9211BCPZ-170 制造商:AD 制造商全稱:Analog Devices 功能描述:10-Bit, 170/200/250 MSPS 1.8 V A/D Converter
AD9211BCPZ-200 功能描述:IC ADC 10-BIT 200MSPS 56-LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 標準包裝:1 系列:- 位數(shù):14 采樣率（每秒）:83k 數(shù)據(jù)接口:串行，并聯(lián) 轉(zhuǎn)換器數(shù)目:1 功率耗散（最大）:95mW 電壓電源:雙 ± 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:28-DIP（0.600"，15.24mm） 供應(yīng)商設(shè)備封裝:28-PDIP 包裝:管件 輸入數(shù)目和類型:1 個單端，雙極
AD9211BCPZ-250 功能描述:IC ADC 10-BIT 250MSPS 56-LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 其它有關(guān)文件:TSA1204 View All Specifications 標準包裝:1 系列:- 位數(shù):12 采樣率（每秒）:20M 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:2 功率耗散（最大）:155mW 電壓電源:模擬和數(shù)字 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:48-TQFP 供應(yīng)商設(shè)備封裝:48-TQFP（7x7） 包裝:Digi-Reel® 輸入數(shù)目和類型:4 個單端，單極；2 個差分，單極 產(chǎn)品目錄頁面:1156 (CN2011-ZH PDF) 其它名稱:497-5435-6
AD9211BCPZ-300 功能描述:IC ADC 10BIT 300MSPS 56LFCSP RoHS:是 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 其它有關(guān)文件:TSA1204 View All Specifications 標準包裝:1 系列:- 位數(shù):12 采樣率（每秒）:20M 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:2 功率耗散（最大）:155mW 電壓電源:模擬和數(shù)字 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:48-TQFP 供應(yīng)商設(shè)備封裝:48-TQFP（7x7） 包裝:Digi-Reel® 輸入數(shù)目和類型:4 個單端，單極；2 個差分，單極 產(chǎn)品目錄頁面:1156 (CN2011-ZH PDF) 其它名稱:497-5435-6
AD9212 制造商:AD 制造商全稱:Analog Devices 功能描述:Octal, 10-Bit, 40/65 MSPS Serial LVDS 1.8 V A/D Converter
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