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參數(shù)資料
| 型號： | AD8390AACPZ-RL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 7/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP DIFF LP LDIST 16LFCSP |
| 標準包裝： | 5,000 |
| 放大器類型： | 差分 |
| 電路數(shù)： | 1 |
| 輸出類型： | 差分 |
| 轉(zhuǎn)換速率： | 300 V/µs |
| -3db帶寬： | 60MHz |
| 電流 - 輸入偏壓： | 4µA |
| 電壓 - 輸入偏移： | 1000µV |
| 電流 - 電源： | 10mA |
| 電流 - 輸出 / 通道： | 400mA |
| 電壓 - 電源，單路/雙路(±)： | 10 V ~ 24 V，±5 V ~ 12 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-VQFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 16-LFCSP-VQ |
| 包裝： | 帶卷 (TR) |
AD8390A
Data Sheet
Rev. B | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
Supply Voltage (VCC VEE)
26 V
VCOM
VEE < VCOM < VCC
Package Power Dissipation
Maximum Junction Temperature (TJ MAX)
150°C
Operating Temperature Range (TA)
–40°C to +85°C
Storage Temperature Range
–65°C to +150°C
Lead Temperature (Soldering, 10 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified in still air with exposed pad soldered to 4-layer
JEDEC test board. θJC is specified at the exposed pad.
Table 3. Thermal Resistance
Package Type
θJA
θJC
Unit
16-Lead LFCSP (CP-16-4)
30.4
16
°C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8390A is
limited by its junction temperature on the die.
The maximum safe junction temperature of plastic encapsu-
lated devices, as determined by the glass transition temperature
of the plastic, is 150°C. Exceeding this limit temporarily may
cause a shift in the parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding this
limit for an extended period can result in device failure.
Figure 2 shows the maximum safe power dissipation in
the package vs. the ambient temperature. θJA values are
approximations.
AMBIENT TEMPERATURE (°C)
MA
XI
MU
M
PO
W
ER
D
ISSI
PA
T
IO
N
(W
)
0
0.5
1.0
1.5
2.0
2.5
3.0
–25
–15
–5
5
15
25
35
45
55
65
75
85
3.5
TJ = 150°C
07094-
003
Figure 2. Maximum Power Dissipation vs. Temperature
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS). Assuming that the load RL is referenced
to midsupply, the total drive power is VS/2 × IOUT, part of which
is dissipated in the package and part in the load (VOUT × IOUT).
RMS output voltages should be considered. If RL is referenced to
VEE as in single-supply operation, the total power is VS × IOUT.
In single-supply operation with RL referenced to VEE, the worst
case is VOUT = VS/2.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more copper in direct contact with the package leads
from PCB traces, through holes, ground, and power planes
reduces θJA.
ESD CAUTION
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