REV. A
AD8350
–4–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD8350 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
Brand Code
AD8350AR15
–40
°C to +85°C
8-Lead SOIC
SO-8
Standard
AD8350AR15-REEL
–40
°C to +85°C
8-Lead SOIC 13" Reel
SO-8
Standard
AD8350AR15-REEL7
–40
°C to +85°C
8-Lead SOIC 7" Reel
SO-8
Standard
AD8350ARM15
–40
°C to +85°C
8-Lead microSOIC
RM-8
J2N
AD8350ARM15-REEL
–40
°C to +85°C
8-Lead microSOIC 13" Reel
RM-8
J2N
AD8350ARM15-REEL7
–40
°C to +85°C
8-Lead microSOIC 7" Reel
RM-8
J2N
AD8350AR20
–40
°C to +85°C
8-Lead SOIC
SO-8
Standard
AD8350AR20-REEL
–40
°C to +85°C
8-Lead SOIC 13" Reel
SO-8
Standard
AD8350AR20-REEL7
–40
°C to +85°C
8-Lead SOIC 7" Reel
SO-8
Standard
AD8350ARM20
–40
°C to +85°C
8-Lead microSOIC
RM-8
J2P
AD8350ARM20-REEL
–40
°C to +85°C
8-Lead microSOIC 13" Reel
RM-8
J2P
AD8350ARM20-REEL7
–40
°C to +85°C
8-Lead microSOIC 7" Reel
RM-8
J2P
AD8350-EVAL
SOIC Evaluation Board
PIN FUNCTION DESCRIPTIONS
Pin
Function
Description
1, 8
IN+, IN–
Differential Inputs. IN+ and IN–
should be ac-coupled (pins have a dc
bias of midsupply). Differential input
impedance is 200
.
2
ENBL
Power-up Pin. A high level (5 V) enables
the device; a low level (0 V) puts device
in sleep mode.
3VCC
Positive Supply Voltage. 5 V to 10 V.
4, 5
OUT+, OUT–
Differential Outputs. OUT+ and
OUT– should be ac-coupled (pins have
a dc bias of midsupply). Differential
input impedance is 200
.
6, 7
GND
Common External Ground Reference.
ABSOLUTE MAXIMUM RATINGS
*
Supply Voltage, VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 V
Input Power Differential . . . . . . . . . . . . . . . . . . . . . . +8 dBm
Internal Power Dissipation . . . . . . . . . . . . . . . . . . . . 400 mW
θJA SOIC (R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100°C/W
θJA SOIC (RM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133°C/W
Maximum Junction Temperature . . . . . . . . . . . . . . . . . 125
°C
Operating Temperature Range . . . . . . . . . . . –40
°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature Range (Soldering 60 sec) . . . . . . . . . 300
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
PIN CONFIGURATION
TOP VIEW
(Not to Scale)
8
7
6
5
1
2
3
4
IN+
ENBL
VCC
OUT+
IN–
GND
OUT–
AD8350