參數(shù)資料
型號(hào)： AD8337BCPZ-R2
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 15/32頁(yè)
文件大?。?/td> 0K
描述： IC AMP VGA LOW NOISE 8-LFCSP
標(biāo)準(zhǔn)包裝： 1
系列： X-AMP®
類型： 可變?cè)鲆娣糯笃?br>
應(yīng)用： 信號(hào)處理
安裝類型： 表面貼裝
封裝/外殼： 8-VFDFN 裸露焊盤，CSP
供應(yīng)商設(shè)備封裝： 8-LFCSP-VD（3x3）
包裝： 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面： 775 (CN2011-ZH PDF)
配用： AD8337-EVALZ-SS-ND - BOARD EVALUATION FOR AD8337 SS
AD8337-EVALZ-INV-ND - BOARD EVALUATION FOR AD8337 INS
AD8337-EVALZ-ND - BOARD EVALUATION FOR AD8337
其它名稱： AD8337BCPZ-R2DKR
AD8337
Rev. C | Page 22 of
32
The offset voltage effect of the AD8337, as with all VGAs, can
appear as a complex waveform when observed across the range
of VGAIN voltage. Generated by multiple sources, each device has
a unique offset voltage (VOS) profile while the GAIN input is
swept through its voltage range. The offset voltage profile seen
in Figure 15 is a typical example. If the VGAIN input voltage is
modulated, the output is the product of the VGAIN and the dc
profile of the offset voltage. This is observed on a scope as a
small ac signal, as shown in Figure 74. In Figure 74, the signal
applied to the VGAIN input is a 1 kHz ramp, and the output voltage
signal is slightly less than 4 mV p-p.
Under certain circumstances, the product of VGAIN and the
offset profile plus spikes is a coherent spurious signal within the
signal band of interest and indistinguishable from desired
signals. In general, the slower the ramp applied to the GAIN
Pin, the smaller the spikes are. In most applications, these
effects are benign and not an issue.
THERMAL CONSIDERATIONS
The thermal performance of LFCSPs, such as the AD8337,
departs significantly from that of leaded devices such as the
larger TSSOP or QFSP. In larger packages, heat is conducted
away from the die by the path provided by the bond wires and
the device leads. In LFCSPs, the heat transfer mechanisms are
surface-to-air radiation from the top and side surfaces of the
package and conduction through the metal solder pad on the
mounting surface of the device.
O
F
S
ET
V
O
L
T
A
G
E
(m
V)
–4
6
10
0
4
8
–800
–2
VGAIN (mV)
–600
–200
–400
400
600
200
800
0
2
–10
–8
–6
05
57
5-
07
5
VS = 2.5
INPUT
OUTPUT
VS = ±2.5V
θJC is the traditional thermal metric used for integrated circuits.
Heat transfer away from the die is a three-dimensional dynamic,
and the path is through the bond wires, leads, and the six
surfaces of the package. Because of the small size of LFCSPs, the
θJC is not measured conventionally. Instead, it is calculated using
thermodynamic rules.
The θJC value of the AD8837 listed in Table 2 assumes that the
tab is soldered to the board and that there are three additional
ground layers beneath the device connected by at least four vias.
For a device with an unsoldered pad, the θJC nearly doubles,
becoming 138°C/W.
Figure 74. Offset Voltage vs. VGAIN for a 1 kHz Ramp
The profile of the waveform shown in Figure 74 is consistent
over a wide range of signals from dc to about 20 kHz. Above
20 kHz, secondary artifacts can be generated due to the effects
of minor internal circuit tolerances, as shown in Figure 75.
These artifacts are caused by settling and time constants of the
interpolator circuit and appear at the output as the voltage
spikes, as shown in Figure 75.
PSI (Ψ)
Table 2 lists a subset of the classic theta specification, ΨJT (Psi
junction to top). θJC is the metric of heat transfer from the die to
the case, involving the six outside surfaces of the package. Ψ(XY)
is a subset of the theta value and the thermal gradient from the
junction (die) to each of the six surfaces. Ψ can be different for
each of the surfaces, but since the top of the package is a fraction of
a millimeter from the die, the surface temperature of the package is
very close to the die temperature. The die temperature is calculated
as the product of the power dissipation and ΨJT. Since the top
surface temperature and power dissipation are easily measured, it
follows that the die temperature is easily calculated. For example,
for a dissipation of 180 mW and a ΨJT of 5.3°C/W, the die
temperature is slightly less than 1°C higher than the surface
temperature.
O
F
S
ET
V
O
L
T
A
G
E
(m
V)
–4
6
10
0
4
8
–800
–2
VGAIN (mV)
–600
–200
–400
400
600
200
800
0
2
–10
–8
–6
VS = 2.5
INPUT
OUTPUT
05
57
5-
07
4
SPIKE
VS = ±2.5V
BOARD LAYOUT
Because the AD8337 is a high frequency device, board layout is
critical. It is very important to have a good ground plane
connection to the VCOM pin. Coupling through the ground
plane, from the output to the input, can cause peaking at higher
frequencies.
Figure 75. VOS Profile for a 50 kHz Ramp
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