參數(shù)資料
型號: AD8015ACHIPS
廠商: ANALOG DEVICES INC
元件分類: 通信及網(wǎng)絡(luò)
英文描述: Wideband/Differential Output Transimpedance Amplifier
中文描述: SPECIALTY TELECOM CIRCUIT, UUC10
封裝: DIE-10
文件頁數(shù): 3/8頁
文件大?。?/td> 153K
代理商: AD8015ACHIPS
AD8015
REV. A
–3–
.
V1
+V
S
CLOCK
RECOVERY
LPF:
3dB@
0.7 x F
LPF:
3dB@
QUANTIZER
R > 40
4.5V < V
S
< 11V
CLK
DATA
R
R
C1
10k
5
6
7
8
4
3
2
1
AD8015
50
+1
G = 3
G = 30
50
+1
– +
+V
S
1.7V
1.7V
+V
S
Figure 3. Fiber Optic Receiver Application: Photodiode
Referred to Positive Supply
PHOT ODIODE RE FE RRE D T O NE GAT IVE SUPPLY
Figure 4 shows the AD8015 used in a circuit where the photo-
diode is referred to the negative supply. T his results in a larger
back bias voltage than when referring the photodiode to the
positive supply. T he larger back bias voltage on the photodiode
decreases the photodiode’s capacitance thereby increasing its
bandwidth. T he R2, C2 network shown in Figure 4 is added to
decouple the photodiode to the positive supply. T his improves
PSRR.
+V
S
1.7V
+V
S
R2
C2
R > 40
< 11V
R2 AND C2 OPTIONAL
V1
+V
S
RCLOCK
LPF:
3dB@
LPF:
3dB@
0.7 x F
QUANTIZER
CLK
DATA
R
R
C1
10k
5
6
7
8
4
3
2
1
AD8015
50
+1
G = 3
G = 30
50
+1
– +
+V
S
1.7V
Figure 4. Fiber Optic Receiver Application: Photodiode
Referred to Negative Supply
FIBE R OPT IC SY ST E M NOISE PE RFORMANCE
T he AD8015 maintains 26.5 nA referred to input (RT I) to 100
MHz. Calculations below translate this specification into mini-
mum power level and bit error rate specifications for SONET
and FDDI systems. T he dominant sources of noise are: 10 k
feedback resistor current noise, input bipolar transistor base
current noise, and input voltage noise.
T he AD8015 has dielectrically isolated devices and bond pads
that minimize stray capacitance at the I
IN
pin. Input voltage
noise is negligible at lower frequencies, but can become the
dominant noise source at high frequencies due to I
IN
pin stray
capacitance. Minimizing the stray capacitance at the I
IN
pin is
critical to maintaining low noise levels at high frequencies. T he
pins surrounding the I
IN
pin (Pins 1 and 3) have no internal
connection and should be left unconnected in an application.
T his minimizes I
IN
pin package capacitance. It is best to have no
ground plane or metal runs near Pins 1, 2, and 3 and to mini-
mize capacitance at the I
IN
pin.
T he AD8015AR (8-pin SOIC) I
IN
pin total stray capacitance is
0.4 pF without the photodiode. Photodiodes used for SONET
or FDDI systems typically add 0.3 pF, resulting in roughly
0.7 pF total stray capacitance.
PIN CONFIGURAT ION
10k
5
6
7
8
4
3
2
1
AD8015
50
+1
NC
I
IN
NC
V
BYP
–V
S
–OUTPUT
+OUTPUT
+V
S
G = 3
G = 30
NC = NO CONNECT
50
+1
– +
+V
S
1.7V
ME T ALIZAT ION PHOT OGRAPH
Dimensions shown in microns. Not to scale.
FIBE R OPT IC RE CE IVE R APPLICAT IONS
In a fiber optic receiver, the photodiode can be placed from the
I
IN
pin to either the positive or negative supply. T he AD8015
converts the current from the photodiode to a differential volt-
age in these applications. T he voltage at the V
BYP
pin is
1.8 V
below the positive supply. T his node must be bypassed with a
capacitor (C1 in Figures 3 and 4 below) to the signal ground. If
large levels of power supply noise exist, then connecting C1 to
+V
S
is recommended for improved noise immunity. For opti-
mum performance, choose C1 such that C1 > 1/(2
π
×
1000
×
f
MIN
); where f
MIN
is the minimum useful
frequency in Hz.
PHOT ODIODE RE FE RRE D T O POSIT IVE SUPPLY
Figure 3 shows the AD8015 used in a circuit where the photo-
diode is referred to the positive supply. T he back bias voltage on
the photodiode is
1.8 V. T his method of referring the photo-
diode provides greater power supply noise immunity (PSRR)
than referring the photodiode to the negative supply. T he signal
path is referred to the positive rail, and the photodiode capaci-
tance is not modulated by high frequency noise that may exist
on the negative rail.
OPTIONAL
+V
S
CONNECTION
+OUTPUT
–OUTPUT
I
IN
V
BYP
973μ
998μ
+V
S
838μ
–V
S
813μ
NOTE:
FOR BEST PERFORMANCE ATTACH PACKAGE
SUBSTRATE TO +V
S
.
MATERIAL AT BACK OF DIE IS SILICON. USE OF
+V
S
OR –V
S
FOR DIE ATTACH IS ACCEPTABLE.
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