AD8014
–4–
REV. B
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8014 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12.6 V
Internal Power Dissipation
2
Small Outline Package (R) . . . . . . . . . . . . . . . . . . . . 0.75 W
SOT-23-5 Package (RT) . . . . . . . . . . . . . . . . . . . . . . 0.5 W
Input Voltage Common Mode . . . . . . . . . . . . . . . . . . . . . .
±
V
S
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . .
±
2.5 V
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Operating Temperature Range . . . . . . . . . . . –40
°
C to +85
°
C
Lead Temperature (Soldering 10 sec) . . . . . . . . . . . . .+300
°
C
ESD (Human Body Model) . . . . . . . . . . . . . . . . . . . . +1500 V
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only, functional operation of the
device at these or any other conditions above listed in the operational section of this
specification is not implied. Exposure to Absolute Maximum Ratings for any
extended periods may affect device reliability.
2
Specification is for device in free air at 25
°
C.
8-Lead SOIC Package
θ
JA
= 155
°
C/W.
5-Lead SOT-23 Package
θ
JA
= 240
°
C/W.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8014
is limited by the associated rise in junction temperature. The
maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic. This is approximately +150
°
C. Even temporarily ex-
ceeding this limit may cause a shift in parametric performance
due to a change in the stresses exerted on the die by the pack-
age. Exceeding a junction temperature of +175
°
C may result in
device failure.
The output stage of the AD8014 is designed for large load cur-
rent capability. As a result, shorting the output to ground or to
power supply sources may result in a very large power dissipa-
tion. To ensure proper operation it is necessary to observe the
maximum power derating tables.
Table I. Maximum Power Dissipation vs. Temperature
Ambient Temp
8
C
Power Watts
SOT-23-5
Power Watts
SOIC
–40
–20
0
+20
+40
+60
+80
+100
0.79
0.71
0.63
0.54
0.46
0.38
0.29
0.21
1.19
1.06
0.94
0.81
0.69
0.56
0.44
0.31
ORDERING GUIDE
Model
AD8014AR
1
AD8014ART
2
AD8014AChips
3
Temperature Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Package Descriptions
Package Options
Brand Code
8-Lead SOIC
5-Lead SOT-23
Not Applicable
SO-8
RT-5
Waffle Pak
Standard
HAA
Not Applicable
NOTES
1
The AD8014AR is also available in 13" Reels of 2500 each and 7" Reels of 750 each.
2
Except for samples, the AD8014ART is only available in 7" Reels of 3000 each and 13" Reels of 10000 each.
3
The AD8014A Chips are available only in Waffle Pak of 400 each. The thickness of the AD8014A Chip is 12mils
±
1 mil. The Substrate should be tied to the +V
S
source.