參數(shù)資料
型號(hào)： AD7912AUJZ-REEL7
廠(chǎng)商： Analog Devices Inc
文件頁(yè)數(shù)： 21/32頁(yè)
文件大?。?/td> 0K
描述： IC ADC 10BIT DUAL 2CH TSOT-23-8
標(biāo)準(zhǔn)包裝： 1
位數(shù)： 10
采樣率（每秒）： 1M
數(shù)據(jù)接口： DSP，MICROWIRE?，QSPI?，串行，SPI?
轉(zhuǎn)換器數(shù)目： 1
功率耗散（最大）： 20mW
電壓電源： 單電源
工作溫度： -40°C ~ 85°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： SOT-23-8 薄型，TSOT-23-8
供應(yīng)商設(shè)備封裝： TSOT-23-8
包裝： 標(biāo)準(zhǔn)包裝
輸入數(shù)目和類(lèi)型： 2 個(gè)單端，單極
其它名稱(chēng)： AD7912AUJZ-REEL7DKR
AD7912/AD7922
Rev. 0 | Page 28 of 32
APPLICATION HINTS
GROUNDING AND LAYOUT
The printed circuit board that houses the AD7912/AD7922
should be designed such that the analog and digital sections are
separated and confined to certain areas of the board. This
facilitates the use of ground planes that can be separated easily.
A minimum etch technique is generally best for ground planes,
because it gives the best shielding. Digital and analog ground
planes should be joined at only one place. If the AD7912/
AD7922 are in a system where multiple devices require an
AGND-to-DGND connection, the connection should still be
made at one point only, a star ground point that should be
established as close as possible to the AD7912/AD7922.
Avoid running digital lines under the device, because these
couple noise onto the die. The analog ground plane should be
allowed to run under the AD7912/AD7922 to avoid noise
coupling. The power supply lines to the AD7912/AD7922
should use as large a trace as possible to provide low impedance
paths and reduce the effects of glitches on the power supply line.
Fast-switching signals like clocks should be shielded with digital
ground to avoid radiating noise to other sections of the board,
and clock signals should never be run near the analog inputs.
Avoid crossover of digital and analog signals. Traces on opposite
sides of the board should run at right angles to each other to
reduce the effects of feedthrough through the board. A micro-
strip technique is by far the best, but is not always possible with
a double-sided board. In this technique, the component side of
the board is dedicated to ground planes, while signals are placed
on the solder side.
Good decoupling is also very important. The analog supply
should be decoupled with 10 F tantalum in parallel with 0.1 F
capacitors to AGND. To achieve the best performance from
these decoupling components, the user should endeavor to keep
the distance between the decoupling capacitor and the VDD and
GND pins to a minimum with short track lengths connecting
the respective pins.
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