TA = 25°C, unless o" />
參數(shù)資料
型號(hào)： AD7829BRZ-REEL
廠(chǎng)商： Analog Devices Inc
文件頁(yè)數(shù)： 25/28頁(yè)
文件大?。?/td> 0K
描述： IC ADC 8BIT 8CH 2MSPS 28-SOIC
標(biāo)準(zhǔn)包裝： 1,000
位數(shù)： 8
采樣率（每秒）： 2M
數(shù)據(jù)接口： 并聯(lián)
轉(zhuǎn)換器數(shù)目： 1
功率耗散（最大）： 36mW
電壓電源： 單電源
工作溫度： -40°C ~ 85°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 28-SOIC（0.295"，7.50mm 寬）
供應(yīng)商設(shè)備封裝： 28-SOIC W
包裝： 帶卷 (TR)
輸入數(shù)目和類(lèi)型： 8 個(gè)單端，單極
AD7822/AD7825/AD7829
Rev. C | Page 6 of 28
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VDD to AGND
0.3 V to +7 V
VDD to DGND
0.3 V to +7 V
Analog Input Voltage to AGND
VIN1 to VIN8
0.3 V to VDD + 0.3 V
Reference Input Voltage to AGND
0.3 V to VDD + 0.3 V
VMID Input Voltage to AGND
0.3 V to VDD + 0.3 V
Digital Input Voltage to DGND
0.3 V to VDD + 0.3 V
Digital Output Voltage to DGND
0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version)
40°C to +85°C
Storage Temperature Range
65°C to +150°C
Junction Temperature
150°C
PDIP Package, Power Dissipation
450 mW
θJA Thermal Impedance
105°C/W
Lead Temperature, (Soldering, 10 sec)
260°C
SOIC Package, Power Dissipation
450 mW
θJA Thermal Impedance
75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
TSSOP Package, Power Dissipation
450 mW
θJA Thermal Impedance
128°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
ESD
1 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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