![](http://datasheet.mmic.net.cn/Analog-Devices-Inc/AD7376ARUZ100_datasheet_95869/AD7376ARUZ100_7.png)
AD7376
Rev. D | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 5.
Parameter
Rating
VDD to GND
0.3 V to +35 V
VSS to GND
+0.3 V to 16.5 V
VDD to VSS
0.3 V to +35 V
VA, VB, VW to GND
VSS to VDD
Maximum Current
IWB, IWA Pulsed
±20 mA
IWB Continuous (RWB ≤ 6 k, A open,
±5 mA
IWA Continuous (RWA ≤ 6 k, B open,
±5 mA
Digital Input and Output Voltages to GND
0 V to VDD + 0.3 V
Operating Temperature Range
40°C to +85°C
Maximum Junction Temperature (TJMAX)2 150°C
Storage Temperature Range
65°C to +150°C
Reflow Soldering
Peak Temperature
260°C
Time at Peak Temperature
20 sec to 40 sec
Package Power Dissipation
(TJMAX TA)/θJA
Thermal Resistance θJA
16-Lead SOIC_W
120°C/W
14-Lead TSSOP
240°C/W
1
Maximum terminal current is bound by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2
Package power dissipation = (TJMAX – TA)/θJA.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION