參數(shù)資料
型號: AD7147AACBZ-500RL7
廠商: Analog Devices Inc
文件頁數(shù): 32/69頁
文件大?。?/td> 0K
描述: IC CDC 13CH SPI W/RAM 25WLCSP
產(chǎn)品變化通告: 8mm Carrier Tape Changes 28/Feb/2012
標準包裝: 1
系列: CapTouch™
類型: 電容數(shù)字轉(zhuǎn)換器
分辨率(位): 16 b
采樣率(每秒): 250k
數(shù)據(jù)接口: 串行,SPI?
電壓電源: 單電源
電源電壓: 2.6 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 25-UFBGA,WLCSP
供應商設備封裝: 25-WLCSP
包裝: 標準包裝
其它名稱: AD7147AACBZ-500RL7DKR
AD7147A
Rev. B | Page 37 of 68
PCB DESIGN GUIDELINES
CAPACITIVE SENSOR BOARD MECHANICAL SPECIFICATIONS
Table 20.
Parameter
Symbol
Min
Typ
Max
Unit
Distance from Edge of Any Sensor to Edge of Grounded Metal Object
D1
0.1
mm
Distance Between Sensor Edges1
D2 = D3 = D4
0
mm
Distance Between Bottom of Sensor Board and Controller Board or Grounded
Metal Casing2
D5
1.0
mm
1 The distance is dependent on the application and the position of the switches relative to each other and with respect to the user’s finger position and handling.
Adjacent sensors with no space between them are implemented differentially.
2 The 1.0 mm specification is intended to prevent direct sensor board contact with any conductive material. This specification, however, does not guarantee an absence
of EMI coupling from the controller board to the sensors. To avoid potential EMI-coupling issues, place a grounded metal shield between the capacitive sensor board
and the main controller board, as shown in Figure 57.
SLIDER
BUTTONS
CAPACITIVE SENSOR
PRINTED CIRCUIT
D1
D3
D4
8-WAY
SWITCH
METAL OBJECT
D2
07
72
7-
0
55
Figure 55. Capacitive Sensor Board, Top View
D5
CAPACITIVE SENSOR BOARD
CONTROLLER PRINTED CIRCUIT BOARD OR METAL CASING
07
72
7-
05
6
Figure 56. Capacitive Sensor Board, Side View
D5
CAPACITIVE SENSOR BOARD
GROUNDED METAL SHIELD
CONTROLLER PRINTED CIRCUIT BOARD OR METAL CASING
077
27
-05
7
Figure 57. Capacitive Sensor Board with Grounded Shield
WLCSP PACKAGE
Nonsolder mask definer PCB fabrication is recommended to
increase the reliability of the solder joint.
The copper pad on the user’s PCB should be 80% of the diameter
of the WLCSP ball. The solder mask opening should be 50 μm
on either side of the copper pad.
See the AN-617 Application Note, MicroCSP Wafer Level Chip
Scale Package, for more information and layout guidelines for
the WLCSP package.
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