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| 型號： | AD5748ACPZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 24/32頁 |
| 文件大小： | 0K |
| 描述： | IC I/V OUTPUT DRIVER 32LFCSP |
| 標準包裝： | 1 |
| 放大器類型： | 儀表 |
| 電路數(shù)： | 1 |
| 轉(zhuǎn)換速率： | 2 V/µs |
| 電流 - 輸出 / 通道： | 15mA |
| 電壓 - 電源，單路/雙路(±)： | ±12 V ~ 24 V |
| 工作溫度： | -40°C ~ 105°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 32-VFQFN 裸露焊盤，CSP |
| 供應(yīng)商設(shè)備封裝： | 32-LFCSP-VQ（5x5） |
| 包裝： | 管件 |
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AD5748
Rev. A | Page 30 of 32
APPLICATIONS INFORMATION
TRANSIENT VOLTAGE PROTECTION
The AD5748 contains ESD protection diodes that prevent damage
from normal handling. The industrial control environment can,
however, subject I/O circuits to much higher transients. To protect
the AD5748 from excessively high voltage transients, external
power diodes and a surge current limiting resistor may be
required, as shown in Figure 54. The constraint on the resistor
value is that, during normal operation, the output level at IOUT
must remain within its voltage compliance limit of AVDD 2.75 V,
and the two protection diodes and resistor must have appropri-
ate power ratings. Further protection can be added with transient
voltage suppressors if needed.
IOUT
AVDD
AVSS
AD5748
RP
RLOAD
0
89
22
-0
56
Figure 54. Output Transient Voltage Protection
THERMAL CONSIDERATIONS
It is important to understand the effects of power dissipation
on the package and on junction temperature. The internal junction
temperature should not exceed 125°C. The AD5748 is packaged
in a 32-lead LFCSP 5, 5 mm × 5 mm package. The thermal
impedance, θJA, is 28°C/W. It is important that the devices are
not operated under conditions that cause the junction tempera-
ture to exceed its junction temperature.
Worst-case conditions occur when the AD5748 is operated from
the maximum AVDD (26.4 V) while driving the maximum
current (24 mA) directly to ground. The quiescent current of the
AD5748 should also be taken into account, nominally ~4 mA.
The following calculations estimate maximum power dissipation
under these worst-case conditions, and determine maximum
ambient temperature based on the power dissipation:
Power Dissipation = 26.4 V × 28 mA = 0.7392 W
Temp Increase = 28°C × 0.7392 W = 20.7°C
Maximum Ambient Temp = 125°C 20.7°C = 104.3°C
These figures assume that proper layout and grounding
techniques are followed to minimize power dissipation,
as outlined in the Layout Guidelines section.
LAYOUT GUIDELINES
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure
the rated performance. The PCB on which the AD5748 is
mounted should be designed so that the AD5748 lies on the
analog plane.
The AD5748 should have ample supply bypassing of 10 μF
in parallel with 0.1 μF on each supply located as close to the
package as possible, ideally right up against the device. The
10 μF capacitors are the tantalum bead type. The 0.1 μF capaci-
tor should have low effective series resistance (ESR) and low
effective series inductance (ESI) such as the common ceramic
types, which provide a low impedance path to ground at high
frequencies to handle transient currents due to internal logic
switching.
In systems where there are many devices on one board, it is often
useful to provide some heat sinking capability to allow the power
to dissipate easily.
AD5748
AVSS
PLANE
BOARD
08
92
2-
05
7
Figure 55. Paddle Connection to Board
The AD5748 has an exposed paddle beneath the device. This
paddle is connected to the AVSS supply for the part. For opti-
mum performance, special considerations should be used to
design the motherboard and to mount the package. For enhanced
thermal, electrical, and board level performance, the exposed
paddle on the bottom of the package is soldered to the correspond-
ing thermal land paddle on the PCB. Thermal vias are designed
into the PCB land paddle area to further improve heat dissipation.
The AVSS plane on the device can be increased (as shown in
Figure 55) to provide a natural heat sinking effect.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AD5748ACPZ-RL7 | 功能描述:IC I/V OUTPUT DRIVER 32LFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- 放大器類型:電流檢測 電路數(shù):1 輸出類型:- 轉(zhuǎn)換速率:- 增益帶寬積:125kHz -3db帶寬:- 電流 - 輸入偏壓:- 電壓 - 輸入偏移:100µV 電流 - 電源:1.1µA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:4-WFBGA，CSPBGA 供應(yīng)商設(shè)備封裝:4-UCSP（2x2） 包裝:剪切帶 (CT) 其它名稱:MAX9634WERS+TCT |
| AD5749 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Industrial Current Out Driver, Single-Supply, 55 V Maximum Supply, Programmable Ranges |
| AD5749ACPZ | 功能描述:IC CURRENT OUT DVR 32-LFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:1 系列:MicroAmplifier™ 放大器類型:通用 電路數(shù):4 輸出類型:- 轉(zhuǎn)換速率:3.5 V/µs 增益帶寬積:1MHz -3db帶寬:- 電流 - 輸入偏壓:5pA 電壓 - 輸入偏移:1500µV 電流 - 電源:220µA 電流 - 輸出 / 通道:60mA 電壓 - 電源，單路/雙路(±):4.5 V ~ 36 V，±2.25 V ~ 18 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:14-SOIC 包裝:剪切帶 (CT) 其它名稱:296-29363-1 |
| AD5749ACPZ-RL7 | 功能描述:IC CURRENT OUT DVR 32-LFCSP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:50 系列:LinCMOS™ 放大器類型:通用 電路數(shù):4 輸出類型:- 轉(zhuǎn)換速率:0.05 V/µs 增益帶寬積:110kHz -3db帶寬:- 電流 - 輸入偏壓:0.7pA 電壓 - 輸入偏移:210µV 電流 - 電源:57µA 電流 - 輸出 / 通道:30mA 電壓 - 電源，單路/雙路(±):3 V ~ 16 V，±1.5 V ~ 8 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:14-SOIC 包裝:管件 產(chǎn)品目錄頁面:865 (CN2011-ZH PDF) 其它名稱:296-1834296-1834-5 |
| AD574A | 制造商:AD 制造商全稱:Analog Devices 功能描述:Complete 12-Bit A/D Converter |
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