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參數(shù)資料
| 型號： | AD5346BCP |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | DAC |
| 英文描述： | Dual 12-bit 80MSPS ADC with serialized LVDS output 48-VQFN -40 to 85 |
| 中文描述： | PARALLEL, 8 BITS INPUT LOADING, 6 us SETTLING TIME, 8-BIT DAC, QCC40 |
| 封裝： | 6 X 6 MM, MO-220-VJJD-2, LFCSP-40 |
| 文件頁數(shù)： | 21/24頁 |
| 文件大?。?/td> | 949K |
| 代理商： | AD5346BCP |
AD5346/AD5347/AD5348
COARSE AND FINE ADJUSTMENT USING
THE AD5346/AD5347/AD5348
Two of the DACs in the AD5346/AD5347/AD5348 can be
paired together to form a coarse and fine adjustment function,
as shown in Figure 47. As with the window comparator
previously described, the description refers to DACs A and B.
Rev. 0 | Page 21 of 24
DAC A provides the coarse adjustment, while DAC B provides
the fine adjustment. Varying the ratio of R1 and R2 changes the
relative effect of the coarse and fine adjustments. With the
resistor values shown, the output amplifier has unity gain for
the DAC A output, so the output range is 0 V to (V
REF
– 1 LSB).
For DAC B, the amplifier has a gain of 7.6 × 10
–3
, giving DAC B
a range equal to 2 LSBs of DAC A.
The circuit is shown with a 2.5 V reference, but reference
voltages up to V
DD
may be used. The op amps indicated allow a
rail-to-rail output swing.
AD780/ADR381/REF192
WITH V
DD
= 5V
V
DD
= 5V
V
OUT
5V
EXT
REF
V
OUT
V
IN
GND
GND
AD5346/AD5347/
AD5348
V
OUT
B
V
OUT
A
V
DD
V
REF
AB
R1
390
R4
390
R2
51.2k
R3
51.2k
0.1
μ
F
0.1
μ
F
10
μ
F
0
Figure 47. Coarse and Fine Adjustment
POWER SUPPLY BYPASSING AND GROUNDING
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure
the rated performance.
The printed circuit board on which the AD5346/AD5347/
AD5348 is mounted should be designed so that the analog and
digital sections are separated and are confined to certain areas
of the board. This facilitates the use of ground planes that can
be separated easily. A minimum etch technique is generally best
for ground planes because it gives the best shielding. Digital and
analog ground planes should be joined in one place only. If the
AD5346/AD5347/AD5348 is the only device requiring an
AGND-to-DGND connection, then the ground planes should
be connected at the AGND and DGND pins of the AD5346/
AD5347/AD5348. If the AD5346/AD5347/AD5348 is in a
system where multiple devices require AGND-to-DGND
connections, the connection should be made at one point only, a
star ground point that should be established as close as possible
to the AD5346/AD5347/AD5348.
The AD5346/AD5347/AD5348 should have ample supply
bypassing of 10 μF in parallel with 0.1 μF on the supply located
as close to the package as possible, ideally right up against the
device. The 10 μF capacitors are the tantalum bead type. The
0.1 μF capacitor should have low effective series resistance
(ESR) and effective series inductance (ESI), such as the
common ceramic types that provide a low impedance path to
ground at high frequencies to handle transient currents due to
internal logic switching.
The power supply lines of the device should use the largest trace
possible to provide low impedance paths and to reduce the
effects of glitches on the power supply line. Fast switching
signals such as clocks should be shielded with digital ground to
avoid radiating noise to other parts of the board, and should
never be run near the reference inputs. Avoid crossover of
digital and analog signals. Traces on opposite sides of the board
should run at right angles to each other to reduce the effects of
feedthrough through the board. A microstrip technique is by far
the best, but not always possible with a double-sided board. In
this technique, the component side of the board is dedicated to
ground plane, while signal traces are placed on the solder side.
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