參數(shù)資料
型號(hào)： AD5336BRUZ
廠商： Analog Devices Inc
文件頁(yè)數(shù)： 10/20頁(yè)
文件大?。?/td> 0K
描述： IC DAC 10BIT QUAD VOUT 28-TSSOP
產(chǎn)品培訓(xùn)模塊： Data Converter Fundamentals
DAC Architectures
標(biāo)準(zhǔn)包裝： 50
設(shè)置時(shí)間： 7µs
位數(shù)： 10
數(shù)據(jù)接口： 并聯(lián)
轉(zhuǎn)換器數(shù)目： 4
電壓電源： 單電源
功率耗散（最大）： 4.5mW
工作溫度： -40°C ~ 105°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 28-TSSOP（0.173"，4.40mm 寬）
供應(yīng)商設(shè)備封裝： 28-TSSOP
包裝： 管件
輸出數(shù)目和類(lèi)型： 4 電壓，單極；4 電壓，雙極
采樣率（每秒）： 143k
產(chǎn)品目錄頁(yè)面： 782 (CN2011-ZH PDF)
REV. 0
AD5334/AD5335/AD5336/AD5344
–18–
Coarse and Fine Adjustment Using the AD5334/AD5335/
AD5336/AD5344
Two of the DACs in the AD5334/AD5335/AD5336/AD5344 can
be paired together to form a coarse and ne adjustment function,
as shown in Figure 39. As with the window comparator previ-
ously described, the description will refer to DACs A, and B and
the reference connections will depend on the actual device used.
DAC A is used to provide the coarse adjustment while DAC B
provides the ne adjustment. Varying the ratio of R1 and R2 will
change the relative effect of the coarse and ne adjustments. With
the resistor values shown the output amplier has unity gain for
the DAC A output, so the output range is zero to (VREF – 1 LSB).
For DAC B the amplier has a gain of 7.6
× 10–3, giving DAC B
a range equal to 2 LSBs of DAC A.
The circuit is shown with a 2.5 V reference, but reference volt-
ages up to VDD may be used. The op amps indicated will allow a
rail-to-rail output swing.
GND
VDD = 5V
EXT
REF
AD780/REF192
WITH VDD = 5V
VIN
VOUT
R2
51.2k
VOUT
5V
0.1 F
10 F
AD5336/AD5344
GND
VREFA
VDD
VOUTA
R1
390
VREFB
VOUTB
R4
390
R3
51.2k
Figure 39. Coarse and Fine Adjustment
Power Supply Bypassing and Grounding
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure
the rated performance. The printed circuit board on which the
AD5334/AD5335/AD5336/AD5344 is mounted should be
designed so that the analog and digital sections are separated,
and conned to certain areas of the board. If the device is in a
system where multiple devices require an AGND-to-DGND
connection, the connection should be made at one point only.
The star ground point should be established as closely as pos-
sible to the device. The AD5334/AD5335/AD5336/AD5344
should have ample supply bypassing of 10
F in parallel with
0.1
F on the supply located as close to the package as possible,
ideally right up against the device. The 10
F capacitors are the
tantalum bead type. The 0.1
F capacitor should have low
Effective Series Resistance (ESR) and Effective Series Inductance
(ESI), like the common ceramic types that provide a low imped-
ance path to ground at high frequencies to handle transient
currents due to internal logic switching.
The power supply lines of the device should use as large a trace
as possible to provide low impedance paths and reduce the
effects of glitches on the power supply line. Fast switching sig-
nals such as clocks should be shielded with digital ground to
avoid radiating noise to other parts of the board, and should
never be run near the reference inputs. Avoid crossover of digital
and analog signals. Traces on opposite sides of the board should
run at right angles to each other. This reduces the effects of
feedthrough through the board. A microstrip technique is by
far the best, but not always possible with a double-sided board.
In this technique, the component side of the board is dedicated
to ground plane while signal traces are placed on the solder side.
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