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參數(shù)資料
| 型號： | ACPM-1403 |
| 元件分類： | 放大器 |
| 英文描述： | 1920 MHz - 1940 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 3 X 3 MM, 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SMT, 8 PIN |
| 文件頁數(shù)： | 6/16頁 |
| 文件大小： | 406K |
| 代理商： | ACPM-1403 |
14
Storage Condition
Packages described in this document must be stored
in sealed moisture barrier, antistatic bags. Shelf life in a
sealed moisture barrier bag is 12 months at <40°C and
90% relative humidity (RH) J-STD-033 p. 7.
Out-of-Bag Time Duration
After unpacking the device must be soldered to the PCB
within 168 hours as listed in the J-STD-020B p.11 with
factory conditions <30°C and 60% RH.
Baking
It is not necessary to re-bake the part if both conditions
(storage conditions and out-of bag conditions) have
been satisfied. Baking must be done if at least one of
the conditions above have not been satisfied. The
baking conditions are 125°C for 12 hours J-STD-033 p.8.
CAUTION
Tape and reel materials typically cannot be baked at
the temperature described above. If out-of-bag expo-
sure time is exceeded, parts must be baked for a longer
time at low temperatures, or the parts must be
de-reeled, de-taped, re-baked and then put back on
tape and reel. (See moisture sensitive warning label on
each shipping bag for information of baking).
Board Rework
Component Removal, Rework and Remount
If a component is to be removed from the board, it is
recommended that localized heating be used and the
maximum body temperatures of any surface mount
component on the board not exceed 200°C. This
method will minimize moisture related component
damage. If any component temperature exceeds
200°C, the board must be baked dry per 4-2 prior to
rework and/or component removal. Component tem-
peratures shall be measured at the top center of the
package body. Any SMD packages that have not exceed-
ed their floor life can be exposed to a maximum body
temperature as high as their specified maximum reflow
temperature.
Removal for Failure Analysis
Not following the above requirements may cause
moisture/reflow damage that could hinder or com-
pletely prevent the determination of the original failure
mechanism.
Baking of Populated Boards
Some SMD packages and board materials are not able
to withstand long duration bakes at 125°C. Examples
of this are some FR-4 materials, which cannot withstand
a 24 hr. bake at 125°C. Batteries and electrolytic
capacitors are also temperature sensitive. With
component and board temperature restrictions in
mind, choose a bake temperature from Table 4-1 in
J-STD 033; then determine the appropriate bake
duration based on the component to be removed. For
additional considerations see IPC-7711 and IPC-7721.
Derating Due to Factory Environmental Conditions
Factory floor life exposures for SMD packages removed
from the dry bags will be a function of the ambient
environmental conditions. A safe, yet conservative,
handling approach is to expose the SMD packages
only up to the maximum time limits for each moisture
sensitivity level as shown in Table 7. This approach,
however, does not work if the factory humidity or
temperature is greater than the testing conditions of
30°C/60% RH. A solution for addressing this problem
is to derate the exposure times based on the
knowledge of moisture diffusion in the component
package materials ref. JESD22-A120). Recommended
equivalent total floor life exposures can be estimated
for a range of humidities and temperatures based on
the nominal plastic thickness for each device.
Table 8 lists equivalent derated floor lives for humidities
ranging from 20-90% RH for three temperature, 20°C,
25°C, and 30°C.
This table is applicable to SMDs molded with novolac,
biphenyl or multifunctional epoxy mold compounds.
The following assumptions were used in calculating Ta-
ble 8:
1. Activation Energy for diffusion = 0.35eV (smallest
known value).
2. For ≤60% RH, use Diffusivity = 0.121exp ( -0.35eV/kT)
mm2/s (this used smallest known Diffusivity @ 30_).
3. For >60% RH, use Diffusivity = 1.320exp ( -0.35eV/kT)
mm2/s (this used largest known Diffusivity @ 30_).
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