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參數(shù)資料
| 型號(hào)： | A82DL1624TG-70IF |
| 廠商： | AMIC Technology Corporation |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM，A82DL16x4T（ü）16兆位（2Mx8 Bit/1Simultaneous行動(dòng)閃存和4M（256Kx16位）新幣 |
| 文件頁(yè)數(shù)： | 53/57頁(yè) |
| 文件大小： | 896K |
| 代理商： | A82DL1624TG-70IF |
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A82DL16x4T(U) Series
PRELIMINARY
(August, 2005, Version 0.0)
52
AMIC Technology, Corp.
SRAM
Data Retention Characteristics
(T
A
= -40
°
C to 85
°
C)
Symbol
Parameter
Min.
Max.
Unit
Conditions
V
DR1
2.0
3.6
V
CE1_S
≥
VCC - 0.2V
V
DR2
VCC for Data Retention
2.0
3.6
V
CE2_S
≤
0.2V,
I
CCDR1_S
Data Retention Current
-
1*
μ
A
VCC_S = 2V,
CE1_S
≥
VCC_S - 0.2V,
V
IN
≥
0V
I
CCDR2_S
-
1*
μ
A
VCC_S = 2V,
CE2_S
≤
0.2V,
V
IN
≥
0V
t
CDR
Chip Disable to Data Retention Time
0
-
ns
See Retention Waveform
t
R
Operation Recovery Time
5
-
ms
*
I
CCDR_S
: max. 1
μ
A at T
A
= 0
°
C to + 40
°
C
Low VCC Data Retention Waveform (1) (
CE1_S
Controlled)
VCC_S
CE1_S
t
CDR
V
IH
3.0V
t
R
V
IH
3.0V
DATA RETENTION MODE
VDR
_Σ ≥
2V
CE1_S
≥
VDR - 0.2V
Low VCC Data Retention Waveform (2) (CE2_S Controlled)
VCC_S
CE2_S
t
CDR
V
IL
3.0V
t
R
V
IL
3.0V
DATA RETENTION MODE
VDR_S
≥
2.0V
CE2_S
≤
0.2V
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| A82DL1624TG-70U | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70UF | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1634UG-70F | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1634UG-70I | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1634UG-70IF | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| A82DL1624TG-70U | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70UF | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624UG-70 | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624UG-70F | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624UG-70I | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
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