- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄375158 > A82DL1624 (AMIC Technology Corporation) Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S PDF資料下載
參數(shù)資料
| 型號： | A82DL1624 |
| 廠商： | AMIC Technology Corporation |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM，A82DL16x4T（ü）16兆位（2Mx8 Bit/1Simultaneous行動閃存和4M（256Kx16位）新幣 |
| 文件頁數(shù)： | 46/57頁 |
| 文件大?。?/td> | 896K |
| 代理商： | A82DL1624 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁當前第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁
A82DL16x4T(U) Series
PRELIMINARY
(August, 2005, Version 0.0)
45
AMIC Technology, Corp.
AC CHARACTERISTICS
Figure 24. Alternate
CE_F
Controlled Write (Erase/Program) Operation Timings
Addresses
WE
OE
CE_F
Data
555 for program
2AA for erase
PA
D
OUT
~
~
I/O
7
~
~
Data Polling
PD for program
30 for sector erase
10 for chip erase
~
t
BUSY
t
WHWH1 or 2
t
AH
t
AS
t
WC
t
WH
t
CP
t
WS
t
CPH
PA for program
SA for sector erase
555 for chip erase
A0 for program
55 for erase
t
RH
t
DS
t
DH
~
~
RESET
RY/BY
t
GHEL
Notes:
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SA = sector address, PD = program data.
3.
7
I/O
is the complement of the data written to the device. D
OUT
is the data written to the device.
4. Waveforms are for the word mode.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| A82DL1624TG-70 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70F | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70I | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70IF | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70U | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| A82DL1624TG-70 | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70F | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70I | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70IF | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
| A82DL1624TG-70U | 制造商:AMICC 制造商全稱:AMIC Technology 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL16x4T(U) 16 Megabit (2Mx8 Bit/1Simultaneous Operation Flash Memory and 4M (256Kx16 Bit) S |
發(fā)布緊急采購，3分鐘左右您將得到回復。