EQ 2-14 where: EQ 2-15 A heat sink wi" />
參數(shù)資料
型號: A54SX32A-2FG256
廠商: Microsemi SoC
文件頁數(shù): 36/108頁
文件大?。?/td> 0K
描述: IC FPGA SX 48K GATES 256-FBGA
標(biāo)準(zhǔn)包裝: 90
系列: SX-A
LAB/CLB數(shù): 2880
輸入/輸出數(shù): 203
門數(shù): 48000
電源電壓: 2.25 V ~ 5.25 V
安裝類型: 表面貼裝
工作溫度: 0°C ~ 70°C
封裝/外殼: 256-LBGA
供應(yīng)商設(shè)備封裝: 256-FPBGA(17x17)
SX-A Family FPGAs
v5.3
2-13
To determine the heat sink's thermal performance, use the following equation:
EQ 2-14
where:
EQ 2-15
A heat sink with a thermal resistance of 9.76°C/W or better should be used. Thermal resistance of heat sinks is a
function of airflow. The heat sink performance can be significantly improved with the presence of airflow.
Carefully estimating thermal resistance is important in the long-term reliability of an Actel FPGA. Design engineers
should always correlate the power consumption of the device with the maximum allowable power dissipation of the
package selected for that device, using the provided thermal resistance data.
Note: The values may vary depending on the application.
θ
JA(TOTAL)
θ
JC
θ
CS
θ
SA
++
=
θ
CS =
0.37°C/W
=
thermal resistance of the interface material between the case and the heat
sink, usually provided by the thermal interface manufacturer
θ
SA =
thermal resistance of the heat sink in °C/W
θ
SA
θ
JA(TOTAL)
θ
JC
θ
CS
=
θ
SA
13.33
°C/W 3.20°C/W
0.37
°C/W
=
θ
SA
9.76
°C/W
=
相關(guān)PDF資料
PDF描述
3357-9215 BACKSHELL 15 POS
A54SX32A-2FGG256 IC FPGA SX 48K GATES 256-FBGA
A54SX32A-1FGG256I IC FPGA SX 48K GATES 256-FBGA
EMC60DRXS CONN EDGECARD 120PS DIP .100 SLD
AMC30DRXS CONN EDGECARD 60POS .100 DIP SLD
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