EQ 2-14 where: EQ 2-15 A heat sink wi" />
參數(shù)資料
型號(hào): A54SX16A-1FGG256I
廠商: Microsemi SoC
文件頁(yè)數(shù): 36/108頁(yè)
文件大?。?/td> 0K
描述: IC FPGA SX 24K GATES 256-FBGA
標(biāo)準(zhǔn)包裝: 90
系列: SX-A
LAB/CLB數(shù): 1452
輸入/輸出數(shù): 180
門(mén)數(shù): 24000
電源電壓: 2.25 V ~ 5.25 V
安裝類(lèi)型: 表面貼裝
工作溫度: -40°C ~ 85°C
封裝/外殼: 256-LBGA
供應(yīng)商設(shè)備封裝: 256-FPBGA(17x17)
SX-A Family FPGAs
v5.3
2-13
To determine the heat sink's thermal performance, use the following equation:
EQ 2-14
where:
EQ 2-15
A heat sink with a thermal resistance of 9.76°C/W or better should be used. Thermal resistance of heat sinks is a
function of airflow. The heat sink performance can be significantly improved with the presence of airflow.
Carefully estimating thermal resistance is important in the long-term reliability of an Actel FPGA. Design engineers
should always correlate the power consumption of the device with the maximum allowable power dissipation of the
package selected for that device, using the provided thermal resistance data.
Note: The values may vary depending on the application.
θ
JA(TOTAL)
θ
JC
θ
CS
θ
SA
++
=
θ
CS =
0.37°C/W
=
thermal resistance of the interface material between the case and the heat
sink, usually provided by the thermal interface manufacturer
θ
SA =
thermal resistance of the heat sink in °C/W
θ
SA
θ
JA(TOTAL)
θ
JC
θ
CS
=
θ
SA
13.33
°C/W 3.20°C/W
0.37
°C/W
=
θ
SA
9.76
°C/W
=
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