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  • 參數(shù)資料
    型號: A43P26161V-95
    廠商: AMIC Technology Corporation
    英文描述: CONNECTOR ACCESSORY
    中文描述: 連接器附件
    文件頁數(shù): 12/44頁
    文件大?。?/td> 1122K
    代理商: A43P26161V-95
    Device Operations
    A43P26161
    PRELIMINARY
    (July, 2005, Version 1.1)
    11
    AMIC Technology, Corp.
    Clock (CLK)
    The clock input is used as the reference for all SDRAM
    operations. All operations are synchronized to the positive
    going edge of the clock. The clock transitions must be
    monotonic between VIL and VIH. During operation with CKE
    high all inputs are assumed to be in valid state (low or high)
    for the duration of set up and hold time around positive edge
    of the clock for proper functionality and ICC specifications.
    Clock Enable (CKE)
    The clock enable (CKE) gates the clock onto SDRAM. If
    CKE goes low synchronously with clock (set-up and hold
    time same as other inputs), the internal clock is suspended
    from the next clock cycle and the state of output and burst
    address is frozen as long as the CKE remains low. All other
    inputs are ignored from the next clock cycle after CKE goes
    low. When all banks are in the idle state and CKE goes low
    synchronously with clock, the SDRAM enters the power
    down mode from the next clock cycle. The SDRAM remains
    in the power down mode ignoring the other inputs as long as
    CKE remains low. The power down exit is synchronous as
    the internal clock is suspended. When CKE goes high at
    least “t
    SS
    + 1
    CLOCK
    ” before the high going edge of the
    clock, then the SDRAM becomes active from the same clock
    edge accepting all the input commands.
    Bank Select (BS0, BS1)
    This SDRAM is organized as 4 independent banks of
    1,048,576 words X 16 bits memory arrays. The BS0, BS1
    inputs is latched at the time of assertion of
    RASand
    CAS
    to select the bank to be used for the operation. The bank
    select BS0, BS1 is latched at bank activate, read, write
    mode register set and precharge operations.
    Address Input (A0 ~ A11)
    The 20 address bits required to decode the 1,048,576 word
    locations are multiplexed into 12 address input pins
    (A0~A11). The 12 bit row address is latched along with
    RAS, BS0 and BS1 during bank activate command. The 8
    bit column address is latched along with
    CAS
    ,
    WE
    , BS0
    and BS1during read or write command.
    NOP and Device Deselect
    When RAS ,
    CAS
    performs no operation (NOP). NOP does not initiate any new
    operation, but is needed to complete operations which
    require more than single clock like bank activate, burst read,
    auto refresh, etc. The device deselect is also a NOP and is
    entered by asserting
    CS
    high.
    CS
    command decoder so that RAS ,
    CAS
    and
    WE
    , and all
    the address inputs are ignored.
    and
    WE
    are high, the SDRAM
    high disables the
    Power-Up
    The following sequence is recommended for POWER UP
    1. Power must be applied to either CKE and DQM inputs to
    pull them high and other pins are NOP condition at the
    inputs before or along with VDD (and VDDQ) supply.
    The clock signal must also be asserted at the same time.
    2. After VDD reaches the desired voltage, a minimum pause
    of 200 microseconds is required with inputs in NOP
    condition.
    3. All banks must be precharged now.
    4. Perform a minimum of 2 Auto refresh cycles to stabilize
    the internal circuitry.
    5. Perform a MODE REGISTER SET cycle to program the
    CAS latency, burst length and burst type as the default
    value of mode register is undefined.
    At the end of one clock cycle from the mode register set
    cycle, the device is ready for operation.
    When the above sequence is used for Power-up, all the
    out-puts will be in high impedance state. The high
    impedance of outputs is not guaranteed in any other
    power-up sequence.
    cf.) Sequence of 4 & 5 may be changed.
    Mode Register Set (MRS)
    The mode register stores the data for controlling the various
    operation modes of SDRAM. It programs the CAS latency,
    addressing mode, burst length, test mode and various
    vendor specific options to make SDRAM useful for variety of
    different applications. The default value of the mode register
    is not defined, therefore the mode register must be written
    after power up to operate the SDRAM. The mode register is
    written by asserting low on
    CS
    ,RAS ,
    CAS
    ,
    WE
    (The
    SDRAM should be in active mode with CKE already high
    prior to writing the mode register). The state of address pins
    A0~A11,
    BS0
    and
    BS1
    CS
    ,RAS,
    CAS
    ,
    WE
    going low is the data written in the
    mode register. One clock cycle is required to complete the
    write in the mode register. The mode register contents can
    be changed using the same command and clock cycle
    requirements during operation as long as all banks are in the
    idle state. The mode register is divided into various fields
    depending on functionality. The burst length field uses
    A0~A2, burst type uses A3, addressing mode uses A4~A6,
    A7~A8, A9, BS0 and BS1 are used for vendor specific
    options or test mode. And the write burst length is
    programmed using A9. A7~A8, A10~A11, BS0 and BS1
    must be set to low for normal SDRAM operation.
    Refer to table for specific codes for various burst length,
    addressing modes and CAS latencies. BS0 and BS1 have to
    be set to “0” to enter the Mode Register.
    in
    the
    same
    cycle
    as
    Extended Mode Register (EMRS)
    The Extended Mode Register controls functions beyond
    those controlled by the Mode Register. These additional
    functions are unique to AMIC’s Low Power SDRAM and
    includes a Refresh Period field (TCSR) for temperature
    compensated self-refresh and a Partial-Array Self Refresh
    field (PASR). The PASR field is used to specify whether only
    bank A and bank B,or bank A,or 1/2 of bank A,or 1/4 of bank
    A be refreshed. Disable banks will not be refreshed in Self-
    Refresh mode and written data will be lost. When only bank
    A is selected it is possible to partial select only half or one
    quarter of bank A. The TCR field has four entries to set
    Refresh Period during self-refresh depending on the case
    temperature of the Low Power devices.
    The Extended Mode Register is programmed via the Mode
    Register Set command (with BS0=0 and BS1=1) and retains
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