TTL Output Module Timing5 t" />
鍙冩暩(sh霉)璩囨枡
鍨嬭櫉锛� A42MX24-PQG208I
寤犲晢锛� Microsemi SoC
鏂囦欢闋佹暩(sh霉)锛� 128/142闋�
鏂囦欢澶�?銆�?/td> 0K
鎻忚堪锛� IC FPGA MX SGL CHIP 36K 208-PQFP
妯�(bi膩o)婧�(zh菙n)鍖呰锛� 24
绯诲垪锛� MX
杓稿叆/杓稿嚭鏁�(sh霉)锛� 176
闁€鏁�(sh霉)锛� 36000
闆绘簮闆诲锛� 3 V ~ 3.6 V锛�4.5 V ~ 5.5 V
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
宸ヤ綔婧害锛� -40°C ~ 85°C
灏佽/澶栨锛� 208-BFQFP
渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 208-PQFP锛�28x28锛�
绗�1闋�绗�2闋�绗�3闋�绗�4闋�绗�5闋�绗�6闋�绗�7闋�绗�8闋�绗�9闋�绗�10闋�绗�11闋�绗�12闋�绗�13闋�绗�14闋�绗�15闋�绗�16闋�绗�17闋�绗�18闋�绗�19闋�绗�20闋�绗�21闋�绗�22闋�绗�23闋�绗�24闋�绗�25闋�绗�26闋�绗�27闋�绗�28闋�绗�29闋�绗�30闋�绗�31闋�绗�32闋�绗�33闋�绗�34闋�绗�35闋�绗�36闋�绗�37闋�绗�38闋�绗�39闋�绗�40闋�绗�41闋�绗�42闋�绗�43闋�绗�44闋�绗�45闋�绗�46闋�绗�47闋�绗�48闋�绗�49闋�绗�50闋�绗�51闋�绗�52闋�绗�53闋�绗�54闋�绗�55闋�绗�56闋�绗�57闋�绗�58闋�绗�59闋�绗�60闋�绗�61闋�绗�62闋�绗�63闋�绗�64闋�绗�65闋�绗�66闋�绗�67闋�绗�68闋�绗�69闋�绗�70闋�绗�71闋�绗�72闋�绗�73闋�绗�74闋�绗�75闋�绗�76闋�绗�77闋�绗�78闋�绗�79闋�绗�80闋�绗�81闋�绗�82闋�绗�83闋�绗�84闋�绗�85闋�绗�86闋�绗�87闋�绗�88闋�绗�89闋�绗�90闋�绗�91闋�绗�92闋�绗�93闋�绗�94闋�绗�95闋�绗�96闋�绗�97闋�绗�98闋�绗�99闋�绗�100闋�绗�101闋�绗�102闋�绗�103闋�绗�104闋�绗�105闋�绗�106闋�绗�107闋�绗�108闋�绗�109闋�绗�110闋�绗�111闋�绗�112闋�绗�113闋�绗�114闋�绗�115闋�绗�116闋�绗�117闋�绗�118闋�绗�119闋�绗�120闋�绗�121闋�绗�122闋�绗�123闋�绗�124闋�绗�125闋�绗�126闋�绗�127闋�鐣�(d膩ng)鍓嶇128闋�绗�129闋�绗�130闋�绗�131闋�绗�132闋�绗�133闋�绗�134闋�绗�135闋�绗�136闋�绗�137闋�绗�138闋�绗�139闋�绗�140闋�绗�141闋�绗�142闋�
40MX and 42MX FPGA Families
1- 82
R e v i sio n 1 1
TTL Output Module Timing5
tENLZ
Enable Pad LOW to Z
6.9
7.6
8.7
10.2
14.3
ns
tGLH
G-to-Pad HIGH
4.9
5.5
6.2
7.3
10.2
ns
tGHL
G-to-Pad LOW
4.9
5.5
6.2
7.3
10.2
ns
tLSU
I/O Latch Output Set-Up
0.7
0.8
1.0
1.4
ns
tLH
I/O Latch Output Hold
0.0
ns
tLCO
I/O Latch Clock-to-Out
(Pad-to-Pad) 32 I/O
7.9
8.8
10.0
11.8
16.5
ns
tACO
Array Latch Clock-to-Out
(Pad-to-Pad) 32 I/O
10.9
12.1
13.7
16.1
22.5
ns
dTLH
Capacitive Loading, LOW to HIGH
0.10
0.11
0.12
0.14
0.20 ns/pF
dTHL
Capacitive Loading, HIGH to LOW
0.10
0.11
0.12
0.14
0.20 ns/pF
CMOS Output Module Timing5
tDLH
Data-to-Pad HIGH
4.9
5.5
6.2
7.3
10.3
ns
tDHL
Data-to-Pad LOW
3.4
3.8
4.3
5.1
7.1
ns
tENZH
Enable Pad Z to HIGH
3.7
4.1
4.7
5.5
7.7
ns
tENZL
Enable Pad Z to LOW
4.1
4.6
5.2
6.1
8.5
ns
tENHZ
Enable Pad HIGH to Z
7.4
8.2
9.3
10.9
15.3
ns
tENLZ
Enable Pad LOW to Z
6.9
7.6
8.7
10.2
14.3
ns
tGLH
G-to-Pad HIGH
7.0
7.8
8.9
10.4
14.6
ns
tGHL
G-to-Pad LOW
7.0
7.8
8.9
10.4
14.6
ns
tLSU
I/O Latch Set-Up
0.7
0.8
1.0
1.4
ns
tLH
I/O Latch Hold
0.0
ns
tLCO
I/O Latch Clock-to-Out
(Pad-to-Pad) 32 I/O
7.9
8.8
10.0
11.8
16.5
ns
Table 1-39 A42MX36 Timing Characteristics (Nominal 3.3 V Operation) (continued)
(Worst-Case Commercial Conditions, VCCA = 3.0 V, TJ = 70掳C)
鈥�3 Speed
鈥�2 Speed
鈥�1 Speed
Std Speed 鈥揊 Speed
Parameter / Description
Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Units
Notes:
1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
can be obtained from the Timer utility.
4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input.
External setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an
external PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
鐩搁棞(gu膩n)PDF璩囨枡
PDF鎻忚堪
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鐩搁棞(gu膩n)浠g悊鍟�/鎶€琛�(sh霉)鍙冩暩(sh霉)
鍙冩暩(sh霉)鎻忚堪
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A42MX24-TQ176 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 36K 176-TQFP RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:MX 鐢�(ch菐n)鍝佸煿瑷�(x霉n)妯″:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 鐗硅壊鐢�(ch菐n)鍝�:Cyclone? IV FPGAs 妯�(bi膩o)婧�(zh菙n)鍖呰:60 绯诲垪:CYCLONE® IV GX LAB/CLB鏁�(sh霉):9360 閭忚集鍏冧欢/鍠厓鏁�(sh霉):149760 RAM 浣嶇附瑷�:6635520 杓稿叆/杓稿嚭鏁�(sh霉):270 闁€鏁�(sh霉):- 闆绘簮闆诲:1.16 V ~ 1.24 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 85°C 灏佽/澶栨:484-BGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:484-FBGA锛�23x23锛�
A42MX24-TQ176A 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 36K 176-TQFP RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:MX 鐢�(ch菐n)鍝佸煿瑷�(x霉n)妯″:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 鐗硅壊鐢�(ch菐n)鍝�:Cyclone? IV FPGAs 妯�(bi膩o)婧�(zh菙n)鍖呰:60 绯诲垪:CYCLONE® IV GX LAB/CLB鏁�(sh霉):9360 閭忚集鍏冧欢/鍠厓鏁�(sh霉):149760 RAM 浣嶇附瑷�:6635520 杓稿叆/杓稿嚭鏁�(sh霉):270 闁€鏁�(sh霉):- 闆绘簮闆诲:1.16 V ~ 1.24 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 85°C 灏佽/澶栨:484-BGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:484-FBGA锛�23x23锛�
A42MX24-TQ176I 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 36K 176-TQFP RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:MX 鐢�(ch菐n)鍝佸煿瑷�(x霉n)妯″:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 鐗硅壊鐢�(ch菐n)鍝�:Cyclone? IV FPGAs 妯�(bi膩o)婧�(zh菙n)鍖呰:60 绯诲垪:CYCLONE® IV GX LAB/CLB鏁�(sh霉):9360 閭忚集鍏冧欢/鍠厓鏁�(sh霉):149760 RAM 浣嶇附瑷�:6635520 杓稿叆/杓稿嚭鏁�(sh霉):270 闁€鏁�(sh霉):- 闆绘簮闆诲:1.16 V ~ 1.24 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 85°C 灏佽/澶栨:484-BGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:484-FBGA锛�23x23锛�
A42MX24-TQ176M 鍒堕€犲晢:Microsemi Corporation 鍔熻兘鎻忚堪:FPGA 36K GATES 912 CELLS 0.45UM 3.3V/5V 176TQFP - Trays 鍒堕€犲晢:Microsemi Corporation 鍔熻兘鎻忚堪:IC FPGA 150 I/O 176TQFP 鍒堕€犲晢:Microsemi Corporation 鍔熻兘鎻忚堪:IC FPGA MX SGL CHIP 36K 176-TQFP