參數(shù)資料
型號: A42MX09-PQG100A
廠商: Microsemi SoC
文件頁數(shù): 54/142頁
文件大小: 0K
描述: IC FPGA MX SGL CHIP 14K 100-PQFP
標準包裝: 66
系列: MX
輸入/輸出數(shù): 83
門數(shù): 14000
電源電壓: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 125°C
封裝/外殼: 100-BQFP
供應商設備封裝: 100-PQFP(14x20)
40MX and 42MX FPGA Families
Re vi s i on 11
1 - 15
JTAG Mode Activation
The JTAG test logic circuit is activated in the Designer software by selecting Tools -> Device Selection.
This brings up the Device Selection dialog box as shown in Figure 1-14. The JTAG test logic circuit can
be enabled by clicking the "Reserve JTAG Pins" check box. Table 1-5 explains the pins' behavior in
either mode.
TRST Pin and TAP Controller Reset
An active reset (TRST) pin is not supported; however, MX devices contain power-on circuitry that resets
the boundary scan circuitry upon power-up. Also, the TMS pin is equipped with an internal pull-up
resistor. This allows the TAP controller to remain in or return to the Test-Logic-Reset state when there is
no input or when a logical 1 is on the TMS pin. To reset the controller, TMS must be HIGH for at least five
TCK cycles.
Boundary Scan Description Language (BSDL) File
Conforming to the IEEE Standard 1149.1 requires that the operation of the various JTAG components be
documented. The BSDL file provides the standard format to describe the JTAG components that can be
used by automatic test equipment software. The file includes the instructions that are supported,
instruction bit pattern, and the boundary-scan chain order. For an in-depth discussion on BSDL files,
please refer to Actel BSDL Files Format Description application note.
BSDL files are grouped into two categories - generic and device-specific. The generic files assign all user
I/Os as inouts. Device-specific files assign user I/Os as inputs, outputs or inouts.
Generic files for MX devices are available on the Microsemi SoC Product Group's website:
Figure 1-14 Device Selection Wizard
Table 1-5
Boundary Scan Pin Configuration and Functionality
Reserve JTAG
Checked
Unchecked
TCK
BST input; must be terminated to logical HIGH or LOW to avoid floating
User I/O
TDI, TMS
BST input; may float or be tied to HIGH
User I/O
TDO
BST output; may float or be connected to TDI of another device
User I/O
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相關代理商/技術參數(shù)
參數(shù)描述
A42MX09-PQG100I 功能描述:IC FPGA MX SGL CHIP 14K 100-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
A42MX09-PQG100M 制造商:Microsemi Corporation 功能描述:FPGA 42MX Family 14K Gates 336 Cells 129MHz/215MHz 0.45um Technology 3.3V/5V 100-Pin PQFP 制造商:Microsemi Corporation 功能描述:FPGA 14K GATES 336 CELLS 129MHZ/215MHZ 0.45UM 3.3V/5V 100PQF - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 83 I/O 100PQFP 制造商:Microsemi Corporation 功能描述:IC FPGA MX SGL CHIP 14K 100-PQFP
A42MX09-PQG160 功能描述:IC FPGA MX SGL CHIP 14K 160-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
A42MX09-PQG160A 功能描述:IC FPGA MX SGL CHIP 14K 160-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)
A42MX09-PQG160I 功能描述:IC FPGA MX SGL CHIP 14K 160-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:MX 標準包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計:- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA(27X27)