TTL Output Module Timing5 (continued" />
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    • 參數(shù)資料
      型號: A40MX02-1PL68
      廠商: Microsemi SoC
      文件頁數(shù): 118/142頁
      文件大?。?/td> 0K
      描述: IC FPGA MX SGL CHIP 3K 68-PLCC
      標準包裝: 19
      系列: MX
      輸入/輸出數(shù): 57
      門數(shù): 3000
      電源電壓: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
      安裝類型: 表面貼裝
      工作溫度: 0°C ~ 70°C
      封裝/外殼: 68-LCC(J 形引線)
      供應(yīng)商設(shè)備封裝: 68-PLCC(24.23x24.23)
      40MX and 42MX FPGA Families
      Re vi s i on 11
      1 - 73
      TTL Output Module Timing5 (continued)
      tLH
      I/O Latch Output Hold
      0.0
      ns
      tLCO
      I/O Latch Clock-to-Out
      (Pad-to-Pad) 32 I/O
      7.7
      8.5
      9.6
      11.3
      15.9
      ns
      tACO
      Array Latch Clock-to-Out
      (Pad-to-Pad) 32 I/O
      14.8
      16.5
      18.7
      22.0
      30.8
      ns
      dTLH
      Capacitive Loading, LOW to HIGH
      0.05
      0.06
      0.07
      0.10 ns/pF
      dTHL
      Capacitive Loading, HIGH to LOW
      0.04
      0.05
      0.06
      0.08 ns/pF
      CMOS Output Module Timing5
      tDLH
      Data-to-Pad HIGH
      4.8
      5.3
      5.5
      6.4
      9.0
      ns
      tDHL
      Data-to-Pad LOW
      3.5
      3.9
      4.1
      4.9
      6.8
      ns
      tENZH
      Enable Pad Z to HIGH
      3.6
      4.0
      4.5
      5.3
      7.4
      ns
      tENZL
      Enable Pad Z to LOW
      3.4
      4.0
      5.0
      5.8
      8.2
      ns
      tENHZ
      Enable Pad HIGH to Z
      7.2
      8.0
      9.0
      10.7
      14.9
      ns
      tENLZ
      Enable Pad LOW to Z
      6.7
      7.5
      8.5
      9.9
      13.9
      ns
      tGLH
      G-to-Pad HIGH
      6.8
      7.6
      8.6
      10.1
      14.2
      ns
      tGHL
      G-to-Pad LOW
      6.8
      7.6
      8.6
      10.1
      14.2
      ns
      tLSU
      I/O Latch Set-Up
      0.7
      0.8
      1.0
      1.4
      ns
      tLH
      I/O Latch Hold
      0.0
      ns
      tLCO
      I/O Latch Clock-to-Out
      (Pad-to-Pad) 32 I/O
      7.7
      8.5
      9.6
      11.3
      15.9
      ns
      tACO
      Array Latch Clock-to-Out
      (Pad-to-Pad) 32 I/O
      14.8
      16.5
      18.7
      22.0
      30.8
      ns
      dTLH
      Capacitive Loading, LOW to HIGH
      0.05
      0.06
      0.07
      0.10 ns/pF
      dTHL
      Capacitive Loading, HIGH to LOW
      0.04
      0.05
      0.06
      0.08 ns/pF
      tHEXT
      Input
      Latch
      External
      Hold
      FO = 32
      FO = 486
      3.9
      4.6
      4.3
      5.2
      4.9
      5.8
      5.7
      6.9
      8.1
      9.6
      ns
      tP
      Minimum Period
      (1/fMAX)
      FO = 32
      FO = 486
      7.8
      8.6
      8.7
      9.5
      10.4
      10.8
      11.9
      18.2
      19.9
      ns
      Table 1-37 A42MX24 Timing Characteristics (Nominal 3.3 V Operation) (continued)
      (Worst-Case Commercial Conditions, VCCA = 3.0 V, TJ = 70°C)
      –3 Speed
      –2 Speed
      –1 Speed
      Std Speed –F Speed
      Units
      Parameter / Description
      Min. Max. Min. Max. Min. Max. Min. Max. Min. Max.
      Notes:
      1. For dual-module macros, use tPD1 + tRD1 + tPDn, tCO + tRD1 + tPDn, or tPD1 + tRD1 + tSUD, whichever is appropriate.
      2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for
      estimating device performance. Post-route timing analysis or simulation is required to determine actual performance.
      3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules
      can be obtained from the Timer utility.
      4. Set-up and hold timing parameters for the Input Buffer Latch are defined with respect to the PAD and the D input.
      External setup/hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an
      external PAD signal to the G input subtracts (adds) to the internal setup (hold) time.
      5. Delays based on 35 pF loading.
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