參數(shù)資料
型號(hào)： A1280A-CQ172C
廠商： Microsemi SoC
文件頁(yè)數(shù)： 54/54頁(yè)
文件大小： 0K
描述： IC FPGA 8K GATES 172-CQFP COM
標(biāo)準(zhǔn)包裝： 1
系列： ACT™ 2
LAB/CLB數(shù)： 1232
輸入/輸出數(shù)： 140
門數(shù)： 8000
電源電壓： 4.5 V ~ 5.5 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 172-CQFP，帶拉桿
供應(yīng)商設(shè)備封裝： 172-CQFP（63.37x63.37）
ACT 2 Family FPGAs
R e visio n 8
2 -3
Package Thermal Characteristics
The device junction to case thermal characteristic is
θjc, and the junction to ambient air characteristic is
θja. The thermal characteristics for θja are shown with two different air flow rates.
Maximum junction temperature is 150
°C.
A sample calculation of the absolute maximum power dissipation allowed for a PQ160 package at
commercial temperature and still air is as follows:
EQ 1
Power Dissipation
P = [ICC standby + ICCactive] * VCC + IOL * VOL * N + IOH* (VCC – VOH) * M
EQ 2
where:
ICC standby is the current flowing when no inputs or outputs are changing
ICCactive is the current flowing due to CMOS switching.
IOL and IOH are TTL sink/source currents.
VOL and VOH are TTL level output voltages.
N is the number of outputs driving TTL loads to VOL.
M is the number of outputs driving TTL loads to VOH.
An accurate determination of N and M is problematical because their values depend on the family type,
design details, and on the system I/O. The power can be divided into two components: static and active.
Table 2-4 Package Thermal Characteristics
Package Type*
Pin Count
θ
jc
θ
ja
Still Air
θ
ja
300 ft./min.
Units
Ceramic Pin Grid Array
100
5
35
17
°C/W
132
5
30
15
°C/W
176
8
23
12
°C/W
Ceramic Quad Flatpack
172
8
25
15
°C/W
Plastic Quad Flatpack1
100
13
48
40
°C/W
144
15
40
32
°C/W
160
15
38
30
°C/W
Plastic Leaded Chip Carrier
84
12
37
28
°C/W
Very Thin Quad Flatpack
100
12
43
35
°C/W
Thin Quad Flatpack
176
15
32
25
°C/W
Notes: (Maximum Power in Still Air)
1. Maximum power dissipation values for PQFP packages are 1.9 W (PQ100), 2.3 W (PQ144), and 2.4 W
(PQ160).
2. Maximum power dissipation for PLCC packages is 2.7 W.
3. Maximum power dissipation for VQFP packages is 2.3 W.
4. Maximum power dissipation for TQFP packages is 3.1 W.
Max. junction temp. (°C) Max. ambient temp. (°C)
–
θ
ja°C/W
---------------------------------------------------------------------------------------------------------------------------------------
150°C 70°C
–
33°C/W
------------------------------------
2.4 W
==
相關(guān)PDF資料
PDF描述
EP2AGX125DF25C5N IC ARRIA II GX FPGA 125K 572FBGA
AMM08DRES CONN EDGECARD 16POS .156 EYELET
HSC49DRYS-S93 CONN EDGECARD 98POS DIP .100 SLD
GMC65DRXN-S734 CONN EDGECARD 130PS DIP .100 SLD
GMC65DRXH-S734 CONN EDGECARD 130PS DIP .100 SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
A1280A-CQ172E 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Field Programmable Gate Array (FPGA)
A1280A-CQ172M 制造商:Microsemi Corporation 功能描述:FPGA ACT 2 Family 8K Gates 1232 Cells 75MHz 1.0um (CMOS) Technology 5V 172-Pin CQFP 制造商:Microsemi SOC Products Group 功能描述:FPGA ACT 2 8K GATES 1232 CELLS 75MHZ 1.0UM 5V 172CQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 8K GATES 172-CQFP MIL
A1280A-CQ176B 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:ACT 2 Family FPGAs
A1280A-CQ176C 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:ACT 2 Family FPGAs
A1280A-CQ176I 制造商:MICROSEMI 制造商全稱:Microsemi Corporation 功能描述:ACT 2 Family FPGAs
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*