
36
A1 42 5A T i m i n g C har a c t e r i st i c s
(W or s t - C as e M i l i t a r y Cond i t i o n s , V CC = 4.5 V, TJ = 1 25°C)
‘–1’ Speed
‘Std’ Speed
Parameter
Description
Min.
Max.
Min.
Max.
Units
Logic Module Propagation Delays1
tPD
Internal Array Module
3.0
3.5
ns
tCO
Sequential Clock to Q
3.0
3.5
ns
tCLR
Asynchronous Clear to Q
3.0
3.5
ns
Logic Module Predicted Routing Delays2
tRD1
FO=1 Routing Delay
1.3
1.5
ns
tRD2
FO=2 Routing Delay
1.9
2.1
ns
tRD3
FO=3 Routing Delay
2.1
2.5
ns
tRD4
FO=4 Routing Delay
2.6
2.9
ns
tRD8
FO=8 Routing Delay
4.2
4.9
ns
Logic Module Sequential Timing
tSUD
Flip-Flop (Latch) Data Input Setup
0.9
1.0
ns
tHD
Flip-Flop (Latch) Data Input Hold
0.0
ns
tSUENA
Flip-Flop (Latch) Enable Setup
0.9
1.0
ns
tHENA
Flip-Flop (Latch) Enable Hold
0.0
ns
tWASYN
Asynchronous Pulse Width
3.8
4.4
ns
tWCLKA
Flip-Flop Clock Pulse Width
3.8
4.4
ns
tA
Flip-Flop Clock Input Period
7.9
9.3
ns
fMAX
Flip-Flop Clock Frequency
125
100
MHz
Input Module Propagation Delays
tINY
Input Data Pad to Y
4.2
4.9
ns
tICKY
Input Reg IOCLK Pad to Y
7.0
8.2
ns
tOCKY
Output Reg IOCLK Pad to Y
7.0
8.2
ns
tICLRY
Input Asynchronous Clear to Y
7.0
8.2
ns
tOCLRY
Output Asynchronous Clear to Y
7.0
8.2
ns
Input Module Predicted Routing Delays1, 3
tIRD1
FO=1 Routing Delay
1.3
1.5
ns
tIRD2
FO=2 Routing Delay
1.9
2.1
ns
tIRD3
FO=3 Routing Delay
2.1
2.5
ns
tIRD4
FO=4 Routing Delay
2.6
2.9
ns
tIRD8
FO=8 Routing Delay
4.2
4.9
ns
Notes:
1.
For dual-module macros, use tPD + tRD1 + tPDn , tCO + tRD1 + tPDn , or tPD1 + tRD1 + tSUD , whichever is appropriate.
2.
Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating device
based on actual routing delay measurements performed on the device prior to shipment.
3.
Optimization techniques may further reduce delays by 0 to 4 ns.