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      參數(shù)資料
      型號: A1010B-1PQG100C
      廠商: Microsemi SoC
      文件頁數(shù): 3/98頁
      文件大?。?/td> 0K
      描述: IC FPGA 1200 GATES 100-PQFP COM
      標(biāo)準(zhǔn)包裝: 66
      系列: ACT™ 1
      LAB/CLB數(shù): 295
      輸入/輸出數(shù): 57
      門數(shù): 1200
      電源電壓: 4.5 V ~ 5.5 V
      安裝類型: 表面貼裝
      工作溫度: 0°C ~ 70°C
      封裝/外殼: 100-BQFP
      供應(yīng)商設(shè)備封裝: 100-PQFP(14x20)
      11
      Hi R e l F P GA s
      P ack ag e Th er m a l Ch ar ac t e r i st i c s
      The device junction to case thermal characteristic is
      θ
      jc, and
      the junction to ambient air characteristic is
      θ
      ja. The thermal
      characteristics for
      θ
      ja are shown with two different air flow
      rates.
      Maximum junction temperature is 150°C.
      A sample calculation of the absolute maximum power
      dissipation allowed for a CPGA 176-pin package at military
      temperature is as follows:
      P o w e r D i ss ip a t io n
      Gener al P o w e r E quat i o n
      P = [ICCstandby + ICCactive] * VCC + IOL * VOL * N +
      IOH * (VCC – VOH) * M
      where:
      ICCstandby is the current flowing when no inputs or outputs
      are changing.
      ICCactive is the current flowing due to CMOS switching.
      IOL, IOH are TTL sink/source currents.
      VOL, VOH are TTL level output voltages.
      N equals the number of outputs driving TTL loads to
      VOL.
      M equals the number of outputs driving TTL loads to
      VOH.
      Accurate values for N and M are difficult to determine
      because they depend on the family type, on the design, and on
      the system I/O. The power can be divided into two
      components—static and active.
      S tat i c P o w e r Co m ponen t
      Actel FPGAs have small static power components that result
      in power dissipation lower than that of PALs or PLDs. By
      integrating multiple PALs or PLDs into one FPGA, an even
      greater reduction in board-level power dissipation can be
      achieved.
      The power due to standby current is typically a small
      component of the overall power. Standby power is calculated
      below for commercial, worst-case conditions.
      The static power dissipated by TTL loads depends on the
      number of outputs driving high or low and the DC load
      current. Again, this value is typically small. For instance, a
      32-bit bus sinking 4 mA at 0.33V will generate 42 mW with all
      outputs driving low, and 140 mW with all outputs driving high.
      Ac ti v e P ower Com p o nent
      Power dissipation in CMOS devices is usually dominated by
      the active (dynamic) power dissipation. This component is
      frequency dependent, a function of the logic and the external
      I/O. Active power dissipation results from charging internal
      chip capacitances of the interconnect, unprogrammed
      antifuses, module inputs, and module outputs, plus external
      capacitance due to PC board traces and load device inputs.
      An additional component of the active power dissipation is
      the totempole current in CMOS transistor pairs. The net
      effect can be associated with an equivalent capacitance that
      Package Type
      Pin Count
      θ
      jc
      θ
      ja
      Still Air
      θ
      ja
      300 ft/min
      Units
      Ceramic Pin Grid Array
      84
      132
      133
      176
      207
      257
      6.0
      4.8
      4.6
      3.5
      2.8
      33
      25
      23
      21
      15
      20
      16
      15
      12
      10
      8
      °C/W
      Ceramic Quad Flat Pack
      84
      132
      172
      196
      256
      7.8
      7.2
      6.8
      6.4
      6.2
      40
      35
      25
      23
      20
      30
      25
      20
      15
      10
      °C/W
      Max. junction temp. (°C) – Max. military temp.
      θ
      ja (°C/W)
      ------------------------------------------------------------------------------------------------------------------
      150°C – 125°C
      23°C/W
      ------------------------------------
      1.1 W
      ==
      Family
      ICC
      VCC
      Power
      ACT 3
      2 mA
      5.25V
      10.5 mW
      1200XL/3200DX
      2 mA
      5.25V
      10.5 mW
      ACT 2
      2 mA
      5.25V
      10.5 mW
      ACT 1
      3 mA
      5.25V
      15.8 mW
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      相關(guān)代理商/技術(shù)參數(shù)
      參數(shù)描述
      A1010B-1PQG100I 功能描述:IC FPGA 1200 GATES 100-PQFP IND RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ACT™ 1 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
      A1010B-1VQ80C 功能描述:IC FPGA 1200 GATES 80-VQFP COM RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ACT™ 1 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
      A1010B-1VQ80I 功能描述:IC FPGA 1200 GATES 80-VQFP IND RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:ACT™ 1 標(biāo)準(zhǔn)包裝:40 系列:SX-A LAB/CLB數(shù):6036 邏輯元件/單元數(shù):- RAM 位總計(jì):- 輸入/輸出數(shù):360 門數(shù):108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應(yīng)商設(shè)備封裝:484-FPBGA(27X27)
      A1010B-1VQ84B 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ACT 1 Series FPGAs
      A1010B-1VQ84C 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:ACT 1 Series FPGAs