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參數(shù)資料
| 型號(hào)： | 8134-HC-6P3 |
| 元件分類： | 連接器件 |
| 英文描述： | INTERCONNECTION DEVICE |
| 封裝： | ROHS COMPLIANT |
| 文件頁(yè)數(shù)： | 1/2頁(yè) |
| 文件大?。?/td> | 121K |
| 代理商： | 8134-HC-6P3 |
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8134-HC-6P3 Product Details
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8134-HC-6P3
TE Internal Number: 6-1437514-9
Active
View 3D PDF
Discrete Sockets
Always EU RoHS/ELV Compliant
(Statement of
Compliance
)
Product Highlights:
Mating Pin Dia. Range = .51 - .76 mm
Socket Length = 3.56 mm
Tin Lead Contact Spring Plating
Production Application
Without Sealant
View all Features
Documentation & Additional Information
Product Drawings:
HOLTITE CONTACTS (PDF, English)
CONTACT PLATED (REF AUGAT 8134-HC-6P2) (PDF, English)
Catalog Pages/Data Sheets:
None Available
Product Specifications:
AUGAT HOLTITE Sockets (PDF, English)
Application Specifications:
AUGAT HOLTITE Sockets (PDF, English)
Instruction Sheets:
None Available
CAD Files: (CAD Format & Compression Information)
2D Drawing (DXF, Version C)
3D Model (IGES, Version C)
3D Model (STEP, Version C)
List all Documents
Additional Information:
Product Line Information
Additional Product Images:
Product Photo
Related Products:
Tooling
Product Features
(Please use the Product Drawing for all design activity)
Product Type Features:
Socket Length (mm [in]) = 3.56 [0.140]
Sealant = Without
Proprietary Name = HOLTITE
Recommended Hole Size (mm [in]) = 1.47 [0.058]
Body Features:
Mating Pin Dia. Range (mm [in]) = 0.51 – 0.76 [0.020 – 0.030]
Spring Material = Beryllium Copper
Contact Features:
Contact Spring Plating = Tin Lead
Contact Base Material = Beryllium Copper
Configuration Features:
Insertion Method = Hand/Semi-Automatic
Industry Standards:
Government/Industry Qualification = No
RoHS/ELV Compliance = RoHS compliant, ELV compliant
Lead Free Solder Processes = Not relevant for lead free process
RoHS/ELV Compliance History = Always was RoHS compliant
Operation/Application:
Application = Production
Packaging Features:
Packaging Method = Loose Piece
Other:
Brand = AMP
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8134-HC-6P3 Product Details - TE
http://www.te.com/catalog/pn/en/6-1437514-9?RQPN=8134-HC-6P3
1 of 2
07-Nov-2011 5:28 PM
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 8134-HC-6P3LF | 制造商:TE Connectivity 功能描述: |
| 8134-HC-8P2 | 功能描述:IC 與器件插座 HOLTITE CONTACT RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點(diǎn)數(shù)量:2011 觸點(diǎn)電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 8134-HC-8P2, | 制造商:TE Connectivity 功能描述:DISCRETE SOCKET, PC BOARD |
| 8134-HC-8P3 | 制造商:TE Connectivity 功能描述:CONN SOCKET .025-.035" .14" TIN |
| 8134-HC-8P3-LF | 功能描述:Pin Receptacle Connector 0.025" ~ 0.035" (0.64mm ~ 0.89mm) No Tail Press-Fit 制造商:te connectivity amp connectors 系列:HOLTITE 包裝:散裝 零件狀態(tài):有效 焊尾類型:無(wú)尾 端接:壓配式 長(zhǎng)度 - 總:0.136"（3.45mm） 可接受的引腳直徑:0.025" ~ 0.035"（0.64mm ~ 0.89mm） 安裝孔直徑:0.058"（1.47mm） 引腳孔直徑:0.042"（1.07mm） 法蘭直徑:- 焊尾直徑:- 插座深度:- 觸頭材料:銅鈹 觸頭鍍層:錫 觸頭鍍層厚度:80μin（2.03μm） 特性:- 工作溫度:-55°C ~ 105°C 板厚度:0.030"（0.76mm） 插入力:- 標(biāo)準(zhǔn)包裝:50,000 |
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