參數(shù)資料
型號(hào): 74LVC1G126GM,115
廠商: NXP Semiconductors
文件頁(yè)數(shù): 9/21頁(yè)
文件大?。?/td> 0K
描述: IC BUFF DVR TRI-ST N-INV 6XSON
產(chǎn)品培訓(xùn)模塊: Logic Packages
特色產(chǎn)品: MicroPak?
標(biāo)準(zhǔn)包裝: 5,000
系列: 74LVC
邏輯類型: 緩沖器/線路驅(qū)動(dòng)器,非反相
元件數(shù): 1
每個(gè)元件的位元數(shù): 1
輸出電流高,低: 32mA,32mA
電源電壓: 2 V ~ 5.5 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 6-XFDFN
供應(yīng)商設(shè)備封裝: 6-XSON,SOT886(1.45x1)
包裝: 帶卷 (TR)
其它名稱: 568-9290-2
74LVC1G126GM,115-ND
74LVC1G126GM-G
74LVC1G126GM-G-ND
935277204115
74LVC1G126
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 12 — 2 July 2012
17 of 21
NXP Semiconductors
74LVC1G126
Bus buffer/line driver; 3-state
Fig 17. Package outline SOT1226 (X2SON5)
References
Outline
version
European
projection
Issue date
IEC
JEDEC
EIAJ
SOT1226
sot1226_po
12-04-10
12-04-25
Unit
mm
max
nom
min
0.35
0.85
0.80
0.75
0.04
0.30
0.25
0.20
0.85
0.80
0.75
0.27
0.22
0.17
0.05
A(1)
Dimensions
Note
1. Dimension A is including plating thickness.
2. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
SOT1226
A1
A3
0.128
0.040
DDh
Eb
e
0.48
kLv
0.1
wy
0.05
scale
01 mm
X
terminal 1
index area
D
E
A
B
detail X
A
A1
A3
C
y
C
y1
54
terminal 1
index area
D h
L
b
k
e
A
C
B
v
C
w
2
1
0.20
0.27
0.22
0.17
y1
X2SON5: plastic thermal enhanced extremely thin small outline package; no leads;
5 terminals; body 0.8 x 0.8 x 0.35 mm
3
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74LVC1G126GN 制造商:NXP Semiconductors 功能描述:Buffer/Line Driver 1-CH Non-Inverting 3-ST CMOS 6-Pin XSON Bulk 制造商:NXP Semiconductors 功能描述:IC BUFFER/LINE DRIVER 3-ST
74LVC1G126GN,132 功能描述:緩沖器和線路驅(qū)動(dòng)器 Bus buffer line driver 3-state RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel
74LVC1G126GS 制造商:NXP Semiconductors 功能描述:IC BUFFER/LINE DRIVER 3-ST