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參數(shù)資料
| 型號： | 74HCT2G66 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Bilateral switches |
| 中文描述： | 雙邊開關 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大?。?/td> | 83K |
| 代理商： | 74HCT2G66 |
2003 May 14
14
Philips Semiconductors
Product specification
Dual 2-input NOR gate
74HC2G02; 74HCT2G02
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| 74HCT2G66DC,125 | 功能描述:模擬開關 IC Analog SW Dual SPST 5.5V 8-Pin RoHS:否 制造商:Texas Instruments 開關數(shù)量:2 開關配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| 74HCT2G66DC-Q100H | 制造商:NXP Semiconductors 功能描述:74HCT2G66DC-Q100/VSSOP8/REELR/ - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC SWITCH DUAL SPST 8VSSOP |
| 74HCT2G66DP,125 | 功能描述:模擬開關 IC 5V DUAL ANALOG SWTCH RoHS:否 制造商:Texas Instruments 開關數(shù)量:2 開關配置:SPDT 開啟電阻（最大值）:0.1 Ohms 切換電壓（最大）: 開啟時間（最大值）: 關閉時間（最大值）: 工作電源電壓:2.7 V to 4.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:DSBGA-16 |
| 74HCT2G66DP/S911,1 | 制造商:NXP Semiconductors 功能描述:74HCT2G66DP/TSSOP8/REELR//S911 - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC SWITCH DUAL SPST 8TSSOP |
| 74HCT2G66DP125 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
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