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參數(shù)資料
| 型號： | 74FST6800QSR |
| 英文描述： | BUS SWITCH|CMOS|SSOP|24PIN|PLASTIC |
| 中文描述： | 總線開關(guān)|的CMOS | SSOP封裝| 24針|塑料 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 84K |
| 代理商： | 74FST6800QSR |
74FST3125
http://onsemi.com
7
PACKAGE DIMENSIONS
QSOP–16
QS SUFFIX
CASE 492–01
ISSUE O
MIN
4.98
3.99
1.73
0.31
0.89
MILLIMETERS
MAX
4.80
3.81
1.55
0.20
0.41
0.64 BSC
0.20
0.249
0.10
5.84
0
0
0.18
0.51 DIA
0.64
0.64
0
G
R
–B–
–A–
L
M
0.25 (0.010)
T
U
–T–
SEATING
PLANE
K
D
16 PL
C
M
0.25 (0.010)
T
B
A
S
S
V
N
J
M
F
8 PL
DETAIL E
DETAIL E
H x 45
RAD.
MOLD PIN
MARK
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
Q
R
U
V
MIN
0.196
0.157
0.068
0.012
0.035
MAX
0.189
0.150
0.061
0.008
0.016
0.025 BSC
0.008
0.0098
0.004
0.230
0
0
0.007
0.020 DIA
0.025
0.025
0
INCHES
0.46
0.191
0.25
6.20
0.018
0.0075
0.010
0.244
8
7
8
7
0.28
0.011
0.89
0.89
8
0.035
0.035
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. THE BOTTOM PACKAGE SHALL BE BIGGER
THAN THE TOP PACKAGE BY 4 MILS (NOTE:
LEAD SIDE ONLY). BOTTOM PACKAGE
DIMENSION SHALL FOLLOW THE DIMENSION
STATED IN THIS DRAWING.
4. PLASTIC DIMENSIONS DOES NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 6 MILS
PER SIDE.
5. BOTTOM EJECTOR PIN WILL INCLUDE THE
COUNTRY OF ORIGIN (COO) AND MOLD CAVITY
I.D.
8
Q
P
0.013 X 0.005
DP. MAX
RAD.
0.005–0.010
TYP
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