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參數(shù)資料
| 型號： | 5962-9553601VPA |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 運(yùn)算放大器 |
| 英文描述： | OP-AMP, 1500 uV OFFSET-MAX, 170 MHz BAND WIDTH, CDIP8 |
| 封裝： | CERAMIC, DIP-8 |
| 文件頁數(shù)： | 20/23頁 |
| 文件大小： | 343K |
| 代理商： | 5962-9553601VPA |
MNLM7171AM-X REV 3A1
MICROCIRCUIT DATA SHEET
(Continued)
Note 3:
The package material for these devices allows much improved heat transfer over our
standard ceramic packages. In order to take full advantage of this improved heat
transfer, heat sinking must be provided between the package base (directly beneath
the die), and either metal traces on, or thermal vias through, the printed circuit
board. Without this additional heat sinking, device power dissipation must be
calculated using junction-to-ambient, rather than junction-to-case,
thermal resistance. It must not be assumed that the device leads will provide
substantial heat transfer out of the package, since the thermal resistance of the
leadframe material is very poor, relative to the material of the package base. The
stated junction-to-case thermal resistance is for the package material only, and does
not account for the additional thermal resistance between the package base and the
printed circuit board. The user must determine the value of the additional thermal
resistance and must combine this with the stated value for the package, to calculate
the total allowed power dissipation for the device.
Note 4:
Applies to both single-supply and split-supply operation. Continuous short circuit
operation at elevated ambient temperature can result in exceeding the maximum allowed
junction temperature of 150 C.
Note 5:
Human body model, 1.5k Ohms in series with 100pF.
Note 6:
Input differential voltage is measured at Vs = +15V.
Note 7:
All numbers apply for packages soldered directly into a PC board.
Recommended Operating Conditions
(Note 1)
Supply Voltage
5.5V < V+ < 36V
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.
Operating Ratings indicate conditions for which the device is functional, but do not
guarantee specific performance limits. For guaranteed specifications and test
conditions, see the Electrical Characteristics. The guaranteed specifications apply
only for the test conditions listed. Some performance characteristics may degrade
when the device is not operated under the listed test conditions.
6
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 5962-9553601VXA | OP-AMP, 1500 uV OFFSET-MAX, 170 MHz BAND WIDTH, CDSO10 |
| 5962-9554901NXD | DUAL COMPARATOR, 10000 uV OFFSET-MAX, CDSO8 |
| 5962-87658012A | DUAL COMPARATOR, 10000 uV OFFSET-MAX, 650 ns RESPONSE TIME, CQCC20 |
| 5962-8765801PA | DUAL COMPARATOR, 10000 uV OFFSET-MAX, 650 ns RESPONSE TIME, CDIP8 |
| 5962-9554901NXDR | DUAL COMPARATOR, 10000 uV OFFSET-MAX, 650 ns RESPONSE TIME, PDSO8 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 5962-9553701QEA | 制造商:Texas Instruments 功能描述:5962-9553701QEA, OCTAL D-TYPE FLIPFLOP - Rail/Tube |
| 59629554101QXA | 制造商:NATIONAL 功能描述:* |
| 59629554301QXA | 制造商:NATIONAL 功能描述:* |
| 5962-9554901NXD | 功能描述:校驗(yàn)器 IC Low-Pwr LinCMOS Dual Comparator RoHS:否 制造商:STMicroelectronics 產(chǎn)品: 比較器類型: 通道數(shù)量: 輸出類型:Push-Pull 電源電壓-最大:5.5 V 電源電壓-最小:1.1 V 補(bǔ)償電壓（最大值）:6 mV 電源電流（最大值）:1350 nA 響應(yīng)時(shí)間: 最大工作溫度:+ 125 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SC-70-5 封裝:Reel |
| 5962-9554901NXDR | 制造商:Texas Instruments 功能描述:Comparator Dual 制造商:Texas Instruments 功能描述:COMPARATOR DUAL 8V/16V 8SOIC - Rail/Tube |
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