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參數(shù)資料
| 型號： | 5591S 210 MM X 300 MM 1.0 MM |
| 廠商： | 3M |
| 文件頁數(shù)： | 3/4頁 |
| 文件大?。?/td> | 0K |
| 描述： | THERM PAD 5591S 210X300MM 1.0MM |
| 特色產(chǎn)品： | Thermal Interface Materials |
| 標(biāo)準(zhǔn)包裝： | 40 |
| 系列： | 5591S |
| 使用： | 片狀 |
| 形狀： | 矩形 |
| 外形： | 210.00mm x 300.00mm |
| 厚度： | 0.040"（1.02mm） |
| 材質(zhì)： | 硅質(zhì) |
| 膠合劑： | 膠粘 - 一側(cè) |
| 背襯，載體： | 聚對苯二甲二乙酯（PET） |
| 顏色： | 白 |
| 導(dǎo)熱性： | 1.0 W/m-K |
| 其它名稱： | 3M9598 WX300901237 |
3M
Thermally Conductive Interface Pads 5591 and 5591S
(3)
3M Thermally Conductive Interface Pads
5516/5516S
0.5, 1.0, 1.5, 2.0
3.1
5519/5519S
0.5 to 2.0
4.1
General Information
Product selection table for 3M Thermally Conductive Materials.
Bulk Thermal
Thickness
Conductivity
Product
(mm)
(W/m-K)
Typical Applications
3M Thermally Conductive Tapes
8805
0.127
8810
0.25
0.6
8815
0.375
8820
0.50
9889FR
1.0
0.5
Applications requiring thin bonding with good thermal transfer; CPU, flex
circuit and power transformer bonding to heat sinks and other cooling
devices. Superior tack and wetting properties.
Applications requiring gap filling and bonding with good thermal transfer;
IC packages and PCB bonding to heat sinks, metal cases and other cooling
devices.
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
3M Thermally Conductive Adhesives
TC-2707
—
0.7
TC-2810
—
1.0 - 1.4
Applications requiring high adhesive strength, good surface wetting, gap
filling and good thermal transfer. IC package and PCB thermal interfacing
with heat sinks or other cooling devices.
3M Thermally Conductive Interface Pads (acrylic)
5590H
0.5 to 1.5
3.0
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
3M Thermally Conductive Interface Pads (silicone based)
5591S
0.5 to 2.0
1.0
5592
1.0 to 2.0
1.1
5592S
0.5 to 2.0
—
5595
1.0 to 2.0
1.6
5595S
0.5 to 2.0
—
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
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PDF描述 |
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| 431510-25-0 | TERM BARRIER 25CIRC 1 ROW .4375 |
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| PS2561AL-1-F3-A | PHOTOCOUPLER 1CH TRANS OUT SMD |
| PS2561DL-1Y-F3-W-A | PHOTOCOUPLER 1CH TRANS 4SMD |
| CBP-13 | TERM BARRIER 13CIRC SGL ROW .375 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 5591S-210x300 | 制造商:3M Electronic Products Division 功能描述:THERM COND PADS 210MMX300M SILICONE |
| 5591S-210x300-20 | 制造商:3M Electronic Products Division 功能描述:THERMAL INTERFACE PAD 210 x 300 x 2mm |
| 5591S-210x300-25 | 制造商:3M Electronic Products Division 功能描述:THERMAL INTERFACE PAD 210x300x1.5mm |
| 5591S-210x300-40 | 制造商:3M Electronic Products Division 功能描述:THERMAL INTERFACE PAD 210 x 300 x 1mm |
| 5591S-210x300-80 | 制造商:3M Electronic Products Division 功能描述:THERMAL INTERFACE PAD 210 x 300 x .5mm |
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