參數(shù)資料
型號: 530613B00000G
廠商: Aavid Thermalloy
文件頁數(shù): 35/116頁
文件大?。?/td> 0K
描述: HEATSINK TO-220 BLACK 1.18"
產(chǎn)品培訓(xùn)模塊: How to Select a Heat Sink
產(chǎn)品目錄繪圖: 530613B00000G
標準包裝: 500
類型: 插件板級
冷卻式包裝: TO-220
固定方法: 把緊螺栓
形狀: 矩形
長度: 1.180"(29.97mm)
寬: 1.000"(25.40mm)
機座外的高度(散熱片高度): 0.500"(12.70mm)
溫升時的功耗: 4W @ 80°C
在強制氣流下的熱敏電阻: 在 600 LFM 時為6°C/W
自然環(huán)境下的熱電阻: 16.7°C/W
材質(zhì):
材料表面處理: 黑色陽極化處理
產(chǎn)品目錄頁面: 2670 (CN2011-ZH PDF)
相關(guān)產(chǎn)品: HS417-ND - MOUNTING KIT TO-220
其它名稱: 530613B00000
6106B-13
HS230
25
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
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AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
7109
Surface mount heat sink for D
2 PAK (TO-263) package semiconductors
Surface mount heat sink for D
2 PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
25.40
(1.000)
19.38
(0.763)
15.24
(0.600)
11.43
(0.450)
11.43
(0.450)
Air VelocityFeet Per Minute
Heat DissipatedWatts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
5
0
20
40
60
80
100
01
2
3
4
5
4
3
1
2
0
400
200
600
800
1000
Moun
ting
Sur
fac
eT
emp
Ri
se
A
bo
ve
Ambien
t—°
C
1.3
(0.05)
12.70
(0.500)
10.16
(0.400)
7.37
(0.290)
30.99
(1.220)
17.53
(0.690)
Air VelocityFeet Per Minute
Heat DissipatedWatts
Th
ermal
Resistanc
eF
rom
MT
G
Sur
fac
et
oAmbien
t—°
C/W
at
t
20
0
10
20
30
40
50
0.0
0.5
1.0
1.5
2.0
2.5
16
12
4
8
0
400
200
600
800
1000
Ca
se
T
emp
R
ise
Ri
se
A
bo
ve
Ambien
t—°
C
Surface mount heat sink for D
3 PAK
(TO-268) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
5734
Surface mount heat sink for D
3 PAK (TO-268) package semiconductors
Tape and Reel information
Part Number
“A” Dim
“B” Dim
“C” Dim
“D” Dim
7106D/TRG
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
7109D/TRG
44.00 (1.730)
40.40 (1.590)
36.00 (1.420)
4.06 (0.160)
573100D00010G
44.00 (1.730)
40.40 (1.590)
16.00 (0.630)
4.06 (0.160)
573300D00010G
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
573400D00010G
44.00 (1.730)
40.40 (1.590)
24.00 (0.940)
4.06 (0.160)
ORDERING INFORMATION
SMT
ORDERING INFORMATION
Part Number
Packaging
7109D/TRG
13" Reel, 125 per reel
7109DG
Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure D on page 26 for board footprint information
ORDERING INFORMATION
Part Number
Packaging
573400D00010G
13" Reel, 250 per reel
573400D00000G
Bulk, 500 per bag
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
See below for tape and reel information
Refer to Figure A and B on page 26 for board footprint information
A
B
C
D
相關(guān)PDF資料
PDF描述
1-1437410-1 CONN TERM BLOCK .200 18POS TIN
501200B00000G HEATSINK 14-16 DIP BLACK .19"
1590WLLBF BOX ALUM 1.97X1.97X1.04" UNPTD
7173DG BOARD LEVEL HEATSINK .375"TO-220
576802B04000G HEAT SINK VERT PLUG-IN TO-220
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
530613B05300G 功能描述:BOARD LEVEL HEAT SINK RoHS:是 類別:風(fēng)扇,熱管理 >> 熱敏 - 散熱器 系列:- 產(chǎn)品目錄繪圖:BDN12-3CB^A01 標準包裝:300 系列:BDN 類型:頂部安裝 冷卻式包裝:分類(BGA,LGA,CPU,ASIC……) 固定方法:散熱帶,粘合劑(含) 形狀:方形,鰭片 長度:1.21"(30.73mm) 寬:1.210"(30.73mm) 直徑:- 機座外的高度(散熱片高度):0.355"(9.02mm) 溫升時的功耗:- 在強制氣流下的熱敏電阻:在 400 LFM 時為6.8°C/W 自然環(huán)境下的熱電阻:19.6°C/W 材質(zhì):鋁 材料表面處理:黑色陽極化處理 產(chǎn)品目錄頁面:2681 (CN2011-ZH PDF) 其它名稱:294-1099
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530614B00000 制造商:Aavid Thermalloy 功能描述:
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