參數(shù)資料
型號： 529701B02500G
廠商： Aavid Thermalloy
文件頁數(shù)： 106/116頁
文件大?。?/td> 0K
描述： BOARD LEVEL HEAT SINK
產(chǎn)品培訓(xùn)模塊： How to Select a Heat Sink
標(biāo)準(zhǔn)包裝： 500
類型： 插件板級，垂直
冷卻式包裝： TO-218
固定方法： 螺栓固定和 PC 引腳
形狀： 矩形
長度： 1.00"（25.40mm）
寬： 1.650"（41.91mm）
機座外的高度（散熱片高度）： 1.000"（25.40mm）
溫升時的功耗： 12W @ 70°C
在強制氣流下的熱敏電阻： 在 200 LFM 時為4.0°C/W
自然環(huán)境下的熱電阻： 5.5°C/W
材質(zhì)： 鋁
材料表面處理： 黑色陽極化處理
其它名稱： 041548
9
HO
W
T
O
S
ELECT
A
HEA
T
SINK
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
The basic equation for heat transfer or power dissipation may be stated as follows:
Where:
PD = the power dissipated by the semiconductor device in watts.
ΔT = the temperature difference of driving potential which causes the flow of heat.
ΣRθ = the sum of the thermal resistances of the heat flow path across which ΔT exists.
The above relationship may be stated in the following forms:
The above equations are generally used to determine the required thermal resistance of the heat sink (RθSA),
since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set.
How To Select a Heat Sink
Where:
TJ = the junction temperature in °C (maximum is usually stated by the manufacturer of the semiconductor device).
TC = case temperature of the semiconductor device in °C.
TS = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in °C.
TA = ambient air temperature in °C.
RθJC = thermal resistance from junction to case of the semiconductor device in °C per watt
(usually stated by manufacturer of semiconductor device).
RθCS = thermal resistance through the interface between the semiconductor device
and the surface on which it is mounted in °C per watt.
RθSA = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in °C per watt.
Figure 1 indicates the location of the various heat
flow paths, temperatures and thermal resistances.
The common practice is to represent the system with
a network of resistances in series as shown in Figure 2.
Atmosphere
or ambient
Mounting surface
(cooler/dissipator)
Semiconductor case
Junction
(heat source)
Interface
Heat flow path mounting
surface to ambient, equation (3)
Heat flow path case
to ambient equation (2)
Heat flow path junction
to ambient, equation (1)
P
D
P
D
T
A
R
θSA
R
θCS
R
θJC
T
S
T
C
T
A
T
J
TJ–TA
PD =
RθJC + RθCS + RθSA
TC–TA
PD =
RθCS + RθSA
TS–TA
PD =
RθSA
Δ T
PD =
ΣRθ
RθCS
RθJC
TS
TA
TJ
RθSA
TC
FIGURE 1
FIGURE 2
How to select a heat sink
相關(guān)PDF資料
PDF描述
579206B00000G BOARD LEVEL HEAT SINK
AXK736147G CONN SOCKET BRD/BRD .4MM 36POS
AXK714347G CONN SOCKET BRD/BRD .4MM 14POS
AXK714247G CONN SOCKET BRD/BRD .4MM 14POS
AXK8L20125BG CONN HEADER F4 .4MM 20POS SMD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
529701B12500 制造商:Aavid Thermalloy 功能描述:BOARD LEVEL EXTRUDED HEAT SINKS
52-970-204-GA0 功能描述:EMI 墊圈與接地墊 FILTER PLATE RoHS:否 制造商:Gore 長度:8 mm 寬度:2.5 mm 厚度:2.4 mm 產(chǎn)品類型:Pads
52-970-204-QA0 功能描述:EMI 墊圈與接地墊 4P 2 ROW STRAIGHT BOLT-IN FILTER PLATE RoHS:否 制造商:Gore 長度:8 mm 寬度:2.5 mm 厚度:2.4 mm 產(chǎn)品類型:Pads
52-970-205-IA2 功能描述:EMI 墊圈與接地墊 FILTER PLATE RoHS:否 制造商:Gore 長度:8 mm 寬度:2.5 mm 厚度:2.4 mm 產(chǎn)品類型:Pads
52-970-205-TA0 功能描述:EMI 墊圈與接地墊 2 X 5P FILTER PLATE STRAIGHT RoHS:否 制造商:Gore 長度:8 mm 寬度:2.5 mm 厚度:2.4 mm 產(chǎn)品類型:Pads
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*