參數(shù)資料
型號(hào): 429.2
元件分類(lèi): 保險(xiǎn)絲
英文描述: Fuse
中文描述: 保險(xiǎn)絲
文件頁(yè)數(shù): 1/1頁(yè)
文件大?。?/td> 107K
代理商: 429.2
30
SURFACEMOUNTFUSES
THIN-FILM SURFACE MOUNT
1206 SMF
Very Fast-Acting Thin-Film Type 429 Series
The 1206 SMF is an extremely small, low profile design
(1206 chip size) utilizing thin-film technology to achieve
precise control of electrical characteristics.
New one-piece element/termination design assures extra
reliability by eliminating the need for soldering, welding or
other joining operations in the manufacture of the fuse.
Semi-rigid substrate eliminates the potential for thermal
shock fractures and decreases the risk of mechanical
damage during pick and place operations.
ELECTRICAL CHARACTERISTICS:
% of Ampere
Rating
100%
200%
300%
Opening
Time at 25
°
C
4 hours,
Min
imum
5 seconds,
Max
imum
0.2 seconds,
Max
imum
AGENCY APPROVALS:
Recognized under the
Components Program of Underwriters Laboratories and
Certified by CSA.
AGENCY FILE NUMBERS:
UL E10480, CSA LR 29862.
INTERRUPTING RATINGS:
0.125 – 3A
50 amperes at rated voltage, VAC/VDC
4 – 7A
35 amperes at rated voltage, VAC/VDC
ENVIRONMENTAL SPECIFICATIONS:
Operating Temperature:
–55°C to 125°C.
Vibration:
Withstands 10–55 Hz per MIL-STD-202F,
Method 201A and 10-2000 Hz at 20 G’s per MIL-STD-202F,
Method 204D, Condition D.
Insulation Resistance (After Opening):
Greater than
10 KOhm.
Resistance to Soldering Heat:
Withstands 60 seconds
above 200°C up to 260°C, maximum.
Thermal Shock:
Withstands 5 cycles of –55° to 125°C.
PHYSICAL SPECIFICATIONS:
Materials:
Body: Epoxy Substrate
Terminations: Copper/Nickel/Tin-Lead (95/5)
Cover Coat: Conformal Coating
Soldering Parameters:
Wave Solder — 260°C, 10 seconds maximum
Reflow Solder — 260°C, 30 seconds maximum
PACKAGING SPECIFICATIONS:
8mm Tape and Reel
per EIA-RS481-2 (IEC 286, part 3); 3,000 per reel, add
packaging suffix, WR.
PATENTED
ORDERING INFORMATION:
Nominal
Catalog
Ampere
Marking
Voltage
Number
Rating
Code
Rating
429
.125
1/8
FB
125
429
.200
2/10
FC
125
429
.250
1/4
FD
125
429
.375
3/8
FE
125
429
.500
1/2
FF
63
429
.750
3/4
FG
63
429
001
1
FH
63
429
1.25
1
1
/
4
FJ
63
429
01.5
1
1
/
2
FK
63
429
1.75
1
3
/
4
FL
63
429
002
2
FN
63
429
02.5
2
1
/
2
FO
32
429
003
3
FP
32
429
004
4
FS
24
429
005
5
FT
24
429
007
7
FU
24
Nominal
Resistance
Cold Ohms
1
2.30000
0.93800
0.62500
0.37500
0.24050
0.13700
0.09950
0.07475
0.06250
0.05000
0.03975
0.03065
0.02625
0.01926
0.01375
0.00925
Nominal
Voltage Drop
(V)
2
0.200
0.175
0.160
0.138
0.130
0.120
0.115
0.108
0.101
0.096
0.093
0.087
0.080
0.070
0.065
0.060
Melting I
2
t
(A
2
Sec.)
3
0.00020
0.00055
0.00100
0.00280
0.0060
0.0170
0.035
0.065
0.125
0.150
0.230
0.50
0.70
1.5
2.7
3.6
1
Measured at 10% of rated current, 25°C.
3
Measured at rated voltage.
2
Measured at 100% of rated current, 25°C.
0.001
0.01
0.1
1
.
0.1
1
10
100
.
.
.
.
.
1
1
1
2
2
3
4
5
T
CURRENT IN AMPERES
Average Time Current Curves
REFLOW SOLDER
WAVE SOLDER
RECOMMENDED PAD LAYOUTS
0.150"
0.065"
0.060"
0.060"
0.080"
0.080"
0.190"
.025"
0.045"
.098"
0.060"
.125"
0.045"
.000
±
±.005
±.005
.044"
±.010
.025"
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