參數(shù)資料
型號(hào)： 3386H-1-504
英文描述： TRIMMER 11MM CERMET EIN 500K 300V 0.5W
中文描述： 修邊機(jī)11毫米艾因500K的300V金屬陶瓷為0.5W
文件頁(yè)數(shù)： 86/86頁(yè)
文件大?。?/td> 3230K
代理商： 3386H-1-504
Specifications are subject to change without notice.
90
Keep in mind the different requirements for accessibility
depending on whether adjustment will be done on the assembly line
or in the field; with the board uncovered, in a housing or cabinet, or
on an extender. Also consider whether production-line adjustment
will be done manually or by robotics. A Bourns applications engineer
can advise on special high-speed automatic adjustment features.
USABILITY
In selecting a trimmer for a specific application, it's important to
be aware that the catalog contains a myriad of facts about each
model that can assist you in finding the most suitable choice. For
example:
Contact Resistance Variation (CRV) — Under MIL-R 22097 and
MIL-R-39035, the maximum CRV is 3%. All Bourns trimmers meet
this standard (3% or 3 ohms, whichever is greater). For applications
that demand a more rigorous standard, some Bourns trimmers are
rated at 2% or 2 ohms, and many others at 1% or 1 ohm.
Power Rating — The ambient temperature at which the trimmer
will operate has an important bearing on power rating. Power ratings
are usually specified at 70o or 85oC; at a temperature of 150oC, the
power rating of many trimmers is reduced to zero.
Temperature Coefficient of Resistance (T.C.) — This specifica-
tion is a measure of how much the resistance changes with a
change in temperature. In many applications a T.C. of ±250PPM/oC
is acceptable. Typical T.C. specifications for cermet models are
±100PPM/oC and ±50PPM/oC for wirewound models.
RELIABILITY
One of the greatest challenges facing American manufactur-
ers in the early '90s lies in the area of reliability — a challenge for
component manufacturers and equipment manufacturers alike.
Bourns has been on the leading edge of this effort, both in the area
of instituting new methods and technologies for achieving higher
reliability, and bringing an awareness of the need to other manufac-
turers.
SURFACE MOUNTED DEVICES (SMD)
AN EMERGING TECHNOLOGY
Surface mounting of electronic components represents another
significant advance in PC board processing. Many U.S. companies
have expressed an interest in SMD assembly methods to replace the
often troublesome and costly techniques now used with leaded
components. Unfortunately, for a number of reasons, this interest
has not resulted to date in a major commitment to SMD handling
equipment.
There are direct and indirect benefits associated with surface
mounting. Since the direct benefits are outgrowths of the indirect
ones, some explanation of these interrelated factors is required in
order to understand this complex, highly technical and investment
intensive subject. Further, a listing of the primary advantages will
make additional comments on J apan's SMD usage and growth
unnecessary.
In capsule format, the primary advantages (with comments on
secondary benefits) are:
Lower End-Equipment Cost
(positions OEM's for aggressive pricing to achieve market
penetration).
Superior Product Performance
(satisfies user requirements for improved operational
performance).
Improved Product Quality and Reliability
(creates confidence factor which easily translates to
increased demand or sales).
Smaller Finished Product Size
(addresses demand for miniaturization).
Cost, performance, quality/reliability and size — how are these
factors interrelated and how are they achieved through surface
mounting
A by-product of SMD technology is the downsizing of compo-
nents. Size reductions range from 25% to 60%, depending upon the
device in question. High PC board densities can be achieved (more
components per square inch of real estate; surface mounted units
can also be assembled on both sides). PC board material savings
alone are substantial. When circuits diminish, external hardware and
other materials follow — further savings. Even freight charges are
decreased by lighter equipment weight and less packaging.
Surface mounted component prices are forecasted to decline,
the result of automated volume production. Volume is directly related
to component standardization. By having a few sizes to cover a large
range of electrical values and/or parameters, large quantities of a
given device can be produced at a much lower per unit cost. Selling
prices fall as volume increases. Component quality is also enhanced
by eliminating many of the variables associated with short produc-
tion runs.
Automatic SMD handling equipment, although capital intensive,
is the single-most effective way to reduce labor costs and increase
yields. Typical "pick and place" machines can assemble compo-
nents 8 to 10 times faster than human assemblers, with virtually no
mistakes. Major direct labor reductions are obvious. The combina-
tion of improved component quality and "mistake-free" component
placement further decreases costs by eliminating the normal rework
of auto-inserted boards.
The many advantages of SMD technology will force change
upon both electronic equipment manufacturers and component
suppliers alike. Worldwide competitive prices and performance
pressures will make it happen. Few electronic components will
escape its influence, trimming potentiometers being no exception.
Bourns is committed to SMD conversion, and we intend to be a
leader in surface mounted trimmer devices. Bourns surface mount
trimmers begin on page 12.
GENERAL NOTES:
Plated-Through Holes: (Ref. MIL-STD-275D).
5.5 Plated-through holes. The difference between the inside diame-
ter of the plated-through hole and the nominal outside diameter
of the inserted lead shall be not greater than 0.028 inch
(0.71mm) or less than 0.010 inch (0.25 mm). Unless otherwise
specified, the hole size shall be the finished plated size after
solder coating or fusing. When flat ribbon leads are mounted
through plated-through holes, the difference between the nomi-
nal thickness of the lead and the inside diameter of the plated-
through hole shall not exceed 0.028 inch (0.71 mm).
Applications/Processing Guide
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
3386H-1-504LF 功能描述:微調(diào)電阻 - 通孔 3/8" 500Kohms 10% 0.5Watts Square RoHS:否 制造商:Vishay/Sfernice 產(chǎn)品:Trimmer Resistors - Multi Turn 產(chǎn)品類型:Multiturn 轉(zhuǎn)數(shù):14 錐度:Linear 電阻:10 kOhms 電壓額定值:250 V 端接類型:Pin 功率額定值:250 mW (1/4 W) 容差:10 % 溫度系數(shù):100 PPM / C
3386H-1-504LF 制造商:Bourns Inc 功能描述:RESISTORS CERMET VARIABLE ROTARY (POTEN
3386H-1-504T 功能描述:微調(diào)電阻 - 通孔 3/8"SQ 500KOHMS 10% 0.5WATTS RoHS:否 制造商:Vishay/Sfernice 產(chǎn)品:Trimmer Resistors - Multi Turn 產(chǎn)品類型:Multiturn 轉(zhuǎn)數(shù):14 錐度:Linear 電阻:10 kOhms 電壓額定值:250 V 端接類型:Pin 功率額定值:250 mW (1/4 W) 容差:10 % 溫度系數(shù):100 PPM / C
3386H-1-504TLF 功能描述:微調(diào)電阻 - 通孔 3/8" 500Kohms 10% 0.5Watts Square RoHS:否 制造商:Vishay/Sfernice 產(chǎn)品:Trimmer Resistors - Multi Turn 產(chǎn)品類型:Multiturn 轉(zhuǎn)數(shù):14 錐度:Linear 電阻:10 kOhms 電壓額定值:250 V 端接類型:Pin 功率額定值:250 mW (1/4 W) 容差:10 % 溫度系數(shù):100 PPM / C
3386H-1-505 功能描述:微調(diào)電阻 - 通孔 3/8"SQ 5MOHMS 10% 0.5WATTS RoHS:否 制造商:Vishay/Sfernice 產(chǎn)品:Trimmer Resistors - Multi Turn 產(chǎn)品類型:Multiturn 轉(zhuǎn)數(shù):14 錐度:Linear 電阻:10 kOhms 電壓額定值:250 V 端接類型:Pin 功率額定值:250 mW (1/4 W) 容差:10 % 溫度系數(shù):100 PPM / C
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